Patents Assigned to Japan Composite Co., Ltd.
  • Patent number: 11753520
    Abstract: An unsaturated polyester resin composition includes a resin component containing an unsaturated polyester and a polymerizable monomer, an aluminum hydroxide, and an expandable graphite. The mixing ratio of the aluminum hydroxide to 100 parts by mass of the resin component is 50 parts by mass or more and 300 parts by mass or less. The mixing ratio of the expandable graphite to 100 parts by mass of the resin component is 3 parts by mass or more and 10 parts by mass or less. The expandable graphite has an average particle size of 150 ?m or less.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: September 12, 2023
    Assignee: JAPAN COMPOSITE CO., LTD.
    Inventors: Ikuo Akai, Masahiro Hakotani
  • Patent number: 7604755
    Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: October 20, 2009
    Assignee: Japan Composite Co., Ltd.
    Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya
  • Publication number: 20060240303
    Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
    Type: Application
    Filed: February 13, 2004
    Publication date: October 26, 2006
    Applicant: JAPAN COMPOSITE CO., LTD.
    Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya
  • Patent number: 7125623
    Abstract: A separator for solid polymer-type fuel cell is produced by molding the resin composition which comprises an electroconductive agent and a radical-polymerizable thermosetting resin system by a resin molding method. The electroconductive agent comprises a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin (especially, a vinyl ester-series resin) and a radical-polymerizable diluent. It is preferred that the double bond equivalent of the radical-polymerizable resin may about 200 to 1,000 and that the hardened radical-polymerizable thermosetting resin system has a glass transition temperature of 120° C. or more. The weight ratio of the electroconductive agent to the radical-polymerizable thermosetting resin system may be about 55/45 to 95/5. Such a separator is suitable for fuel cell (in particular, solid polymer-type fuel cell), and can be produced with advantageous for commercial production.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: October 24, 2006
    Assignee: Japan Composite Co., Ltd.
    Inventors: Hiroya Okumura, Takashi Shibata
  • Patent number: 6815053
    Abstract: A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.
    Type: Grant
    Filed: January 2, 2003
    Date of Patent: November 9, 2004
    Assignees: Japan Composite Co., Ltd., Matsushita Electric Works, Ltd.
    Inventors: Tomoko Inoue, Hiroya Okumura, Isao Hirata, Shigehiro Okada