Patents Assigned to Japan Electronic Materials Corportion
  • Testing apparatus of semiconductor wafers
    Patent number: 4518914
    Abstract: A testing apparatus of semiconductor wafers includes a base plate and a probe card including probe needles, wherein the probe card is detachably affixed to the base plate under air suction, which is derived from a vacuum produced in an airtightly sealed space provided between the base plate and the probe card.
    Type: Grant
    Filed: August 2, 1982
    Date of Patent: May 21, 1985
    Assignee: Japan Electronic Materials Corportion
    Inventors: Masao Okubo, Yasuro Yoshimitsu, Fumio Nakai, Oliver R. Garretson