Patents Assigned to Japan Epoxy Resins Co., Ltd.
-
Patent number: 7491774Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).Type: GrantFiled: February 12, 2007Date of Patent: February 17, 2009Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
-
Patent number: 7307128Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).Type: GrantFiled: August 27, 2004Date of Patent: December 11, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Atsuhito Hayakawa, Akihiro Itou
-
Patent number: 7304120Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.Type: GrantFiled: January 26, 2007Date of Patent: December 4, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Atsuhito Hayakawa, Akihiro Itou
-
Patent number: 7285602Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less.Type: GrantFiled: March 5, 2004Date of Patent: October 23, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
-
Publication number: 20070135616Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).Type: ApplicationFiled: February 12, 2007Publication date: June 14, 2007Applicant: JAPAN EPOXY RESINS CO., LTD.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
-
Publication number: 20070123684Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.Type: ApplicationFiled: January 26, 2007Publication date: May 31, 2007Applicant: JAPAN EPOXY RESINS CO., LTD.Inventors: Atsuhito Hayakawa, Akihiro Itou
-
Publication number: 20060194063Abstract: Alicyclic epoxy resins having high transparency, suited for application to optical materials, coating materials, etc., and solid at normal temperature are provided. These alicyclic epoxy resins meet the following requirements (a) to (d): (a) epoxy equivalent is 500 to 10,000; (b) nuclear hydrogenation rate is not lower than 96%; (c) softening temperature as measured by the ring and ball method of JIS-K-7234 is 40 to 200° C.; and (d) light transmittance measured at a wavelength of 400 nm is not less than 90%.Type: ApplicationFiled: February 23, 2006Publication date: August 31, 2006Applicants: MITSUBISHI CHEMICAL CORPORATION, JAPAN EPOXY RESINS CO., LTD.Inventors: Kouya Murai, Yoshinobu Oonuma
-
Publication number: 20040202864Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation.Type: ApplicationFiled: March 5, 2004Publication date: October 14, 2004Applicant: JAPAN EPOXY RESINS CO., LTD.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
-
Patent number: 6548620Abstract: The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.Type: GrantFiled: October 16, 2001Date of Patent: April 15, 2003Assignee: Japan Epoxy Resins Co., Ltd.Inventor: Yasuyuki Murata
-
Patent number: 6531549Abstract: A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50° C. and 130° C. to an endotherm between 80° C. and 125° C., measured by raising the temperature at a rate of 10° C. per minute using a DSC device, is 1.03 or more.Type: GrantFiled: December 12, 2001Date of Patent: March 11, 2003Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Masayuki Tsutsumi, Kiyotaka Ikebata, Ken Tanaka
-
Publication number: 20020123602Abstract: A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50° C. and 130° C. to an endotherm between 80° C. and 125° C., measured by raising the temperature at a rate of 10° C. per minute using a DSC device, is 1.03 or more.Type: ApplicationFiled: December 12, 2001Publication date: September 5, 2002Applicant: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Masayuki Tsutsumi, Kiyotaka Ikebata, Ken Tanaka
-
Publication number: 20020077422Abstract: The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′, 5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.Type: ApplicationFiled: October 16, 2001Publication date: June 20, 2002Applicant: Japan Epoxy Resins Co., Ltd.Inventor: Yasuyuki Murata