Abstract: Provided is a laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, one of a plurality of optical lenses is a conical lens, wherein an incident surface or a emitting surface of the conical lens is a conical surface, and a central portion of the conical lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the conical lens, and the conical lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object.

Abstract: In accordance with an aspect of the invention, a solder paste feeding device feeds solder paste to a ring-like terminal surrounding a through-hole and a rod terminal fitted in the through-hole so as to fill in the through-hole, the laser beam irradiation device irradiates the solder past with a laser beam, and wire solder is further fed from above the solder past at the same time as melting of the solder paste is started, thereby fusing the wire solder and the solder paste to solder the ring-like terminal and the rod terminal.

Abstract: A first roller is arranged on one side of a transfer path for transferring flux cored wire solder, and a second roller is arranged on the other side. The first roller has on its outer circumference a guide groove in which the wire solder is fitted. The second roller is provided, with a grooving blade and a feed blade closely contacted to each other. The grooving blade comprises a continuous blade edge on the outer circumference, and the feed blade has on its outer circumference a plurality of engaging claws intermittently formed at a constant pitch. The second roller is driven and rotated to thereby advance and retract the wire solder by means of the feed blade, and thus the wire solder is grooved by the grooving blade.

Abstract: In accordance with an aspect of the invention, a solder paste feeding device feeds solder paste to a ring-like terminal surrounding a through-hole and a rod terminal fitted in the through-hole so as to fill in the through-hole, the laser beam irradiation device irradiates the solder past with a laser beam, and wire solder is further fed from above the solder past at the same time as melting of the solder paste is started, thereby fusing the wire solder and the solder paste to solder the ring-like terminal and the rod terminal.

Abstract: A laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, a portion of a plurality of optical lenses is a corn lens, wherein an incident surface or a emitting surface of the corn lens is a conical surface, and a central portion of the corn lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the corn lens, and the corn lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object.

Abstract: After a reducing gas is mixed with an inert gas by a mixer, a resultant mixed gas is heated by a heater and made to a hot mixed gas which is dehumidified and dried and the temperature of which is increased. The mixed gas is injected to a subject from an injection port formed in a soldering iron, and thereby soldering is performed by heating and melting solder with the soldering iron in the atmosphere of the mixed gas.

Abstract: An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.

Abstract: After a reducing gas is mixed with an inert gas by a mixer, a resultant mixed gas is heated by a heater and made to a hot mixed gas which is dehumidified and dried and the temperature of which is increased. The mixed gas is injected to a subject from an injection port formed in a soldering iron, and thereby soldering is performed by heating and melting solder with the soldering iron in the atmosphere of the mixed gas.

Abstract: A soldering apparatus with a safety device which operates automatically when a soldering iron is left in its on condition for a given period of time. A vibration sensor is attached to the soldering iron to sense vibrations of the soldering iron during soldering work. A heater control circuit is provided to be switched to a low-temperature mode when a period of time for which the vibration sensor does not sense the vibrations of the soldering iron continuously exceeding a set value, thereby maintaining the soldering iron at a predetermined low temperature in this situation.