Patents Assigned to JBJ Mechatronic ApS
  • Binding apparatus
    Patent number: 8607696
    Abstract: The present invention relates to a binding apparatus for binding a wire around one or more objects. In particular the present invention relates to a binding apparatus wherein a wire is automatically guided around the object(s). Moreover, the present invention relates to a shaping tool for shaping a wire to have a predetermined curvature.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: December 17, 2013
    Assignee: JBJ Mechatronic ApS
    Inventors: Kim Jensen, Johan C. Gregersen