Abstract: A package structure and a method for forming the same are disclosed. In the method for forming the package structure, a first bonding layer and a plurality of protruded metal pillars are formed on an upper surface of a carrier plate; a first chip including a first functional face and a first back face that are opposite to each other is provided, where a plurality of first external connection terminals are arranged on the first functional face, and a second bonding layer is arranged on the first back face; the second bonding layer is bonded to the first bonding layer; a first molding layer configured to mold the first chip and the metal pillars is provided; a second chip including a second functional face and a second back face that are opposite to each other is provided, and the second chip is flip-mounted on the first molding layer.

Abstract: The present invention relates to the technical field of chip package, in particular to a semiconductor package injection molding mold, a semiconductor package injection molding device and a semiconductor package injection molding method. The semiconductor package injection molding mold includes a bottom mold and a top mold. The upper surface of the bottom mold is fitted with the lower surface of a substrate to form a semiconductor package structure; the top mold is matched with the bottom mold; the top mold has a cavity; the cavity is oriented toward the upper surface of the substrate and is used to accommodate a plastic package layer formed on the upper surface of the substrate; through holes that penetrate through the bottom mold are formed at positions corresponding to the substrate in the bottom mold; and the through holes are connected with an external pressure source.