Abstract: A coating agent for forming an oxide film; a method for producing an oxide film; and a method for producing a metal-plated structure, where the stability of the coating agent can be enhanced, and an oxide film which can be plated and has high adhesion to a substrate can be easily formed. The coating agent for forming an oxide film is a liquid coating agent, essentially contains titanium atoms, and optionally contains silicon atoms and copper atoms, wherein the ratio of the sum of the titanium atoms and copper atoms to the silicon atoms is 1:0-3:2. The method for producing an oxide film includes applying the coating agent to a substrate and heating to form an oxide film. The method for producing a metal-plated structure includes: a metal-film-forming step for forming a metal film on the oxide film; and a baking step for baking the metal film.

Abstract: A substrate is held in a substrate holder and accommodated in a treatment chamber. A positive electrode panel is arranged opposite to a surface of the substrate. Process gas is sent from a blower panel, toward the positive electrode panel and the substrate. A positive electrode of a high-frequency power source is connected to the positive electrode panel, and a negative electrode of the high-frequency power source is connected to the blower panel, to apply a high-frequency voltage. The process gas passes between the positive electrode panel and the blower panel which is the negative electrode, so that plasma is generated. The generated plasma removes contaminants on the surface of the substrate.

Abstract: A microporous plating solution characterized by containing nonconductive particles and polyaluminum chloride allows for easy preparation of positively charged nonconductive particles and is highly stable. Then, a method for performing microporous plating on an object to be plated, characterized by plating the object to be plated in the microporous plating solution results in a favorable number of micropores in the plating.

Abstract: Provided is a technique for coloring without any problem with waste water or stability of color development or deposition. A plating solution for coloring characterized by containing a molybdate and a carboxylic acid having one or more carboxyl groups and one or more hydroxy groups and having two or more carbon atoms or a salt thereof, and having a pH of 4.5 to 7.5. A method for coloring a member to be plated characterized by electrolyzing the member to be plated as a cathode in this plating solution for coloring.

Abstract: A trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH-buffering agent, and further containing an organic compound having 2-4 carbon atoms and three or more chloro groups, and a trivalent chromium plating method using the same provide a practical trivalent chromium plating with enhanced corrosion resistance as compared to the ordinary trivalent chromium plating.

Abstract: A trivalent chromium plating solution that does not cause the problems including the occurrence of deposition failure of the plating and color unevenness, such as a brown stripe pattern, in the plating even though a metal impurity is incorporated into the plating solution, and a trivalent chromium plating method are provided by a trivalent chromium plating solution containing a trivalent chromium compound, a chloride as a conductive salt, a pH buffering agent, and a complexing agent, further containing an unsaturated sulfonic acid compound represented by the following general formula (1) (wherein in the formula (1), R1 represents a hydrocarbon group having a number of carbon atoms of from 1 to 10, hydrogen, or a halogen; R2 represents nothing or a hydrocarbon group having a number of carbon atoms of from 1 to 10; and X represents hydrogen or an alkali metal), and a trivalent chromium plating method using the same.

Abstract: A trivalent chromium plating solution having a high plating deposition rate and being practical is provided with a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, potassium sulfate and ammonium sulfate as a conductive salt, a pH buffer, and a sulfur-containing organic compound, containing a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof as the complexing agent, and containing a combination of saccharin or a salt thereof and a sulfur-containing organic compound having an allyl group as the sulfur-containing organic compound.

Abstract: Provided are a technique with which a satin-like appearance can be obtained in nickel-plating by a nickel-plating additive characterized by containing a benzethonium salt, a satin nickel-plating bath containing the same, and a satin nickel-plating method using the same.

Abstract: A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating.

Abstract: A treatment device has: a treatment tank provided with a constant temperature heater on the outer periphery; an electrolytic cell continuing from a pipe provided with a circulation pump; and a pipe for supply to the treatment tank from the electrolytic cell. Within the electrolytic cell are provided an anode and a cathode formed from diamond electrodes and a bipolar electrode disposed between the two. The treatment tank and the electrolytic cell are filled with a prescribed concentration of sulfuric acid. The treatment device is configured such that a persulfate solution such as peroxydisulfuric acid is generated by electrolysis of the sulfuric acid by making a prescribed current flow from a direct current power supply unit to the anode and the cathode, and this persulfate solution can be supplied to the treatment tank via the pipe.

Abstract: A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.

Abstract: A novel technique that is a resin etching technique without using chromic acid and can be operated at an industrial level is provided by a resin surface etching method characterized in that, in etching a resin surface, one set of the following steps (a) and (b) is performed two or more times without performing a resin swelling step: (a) a step of treating the resin surface with a solution containing an oxidizing agent and adsorbing the oxidizing agent on the resin surface, and (b) a step of activating the oxidizing agent adsorbed on the resin surface in the step (a).

Abstract: An object of the present invention is to provide a silicon oligomer having a novel function that has not been achieved by a conventional condensation product of water and a tetraalkoxysilane. Provided are a silicon oligomer represented by the following formula (I) and a production method therefor: wherein R1 to R10 each independently is an alkyl group or a hydroxyalkyl group, each having 1 to 4 carbon atoms; X1 to X3 each independently is a group represented by the following formula (II); n is 0 or 1; and m is an integer of 1 to 3 when n is 0, and m is 1 when n is 1: wherein A is an alkylene group having 2 to 4 carbon atoms which may be branched, and 1 is an integer of 1 to 3.

Abstract: Provided is a technique for coloring without any problem with waste water or stability of color development or deposition. A plating solution for coloring characterized by containing a molybdate and a carboxylic acid having one or more carboxyl groups and one or more hydroxy groups and having two or more carbon atoms or a salt thereof, and having a pH of 4.5 to 7.5. A method for coloring a member to be plated characterized by electrolyzing the member to be plated as a cathode in this plating solution for coloring.

Abstract: A plasma generating device with a pair of plate-like conductor parts each having a plurality of through-holes passing between main surfaces are opposed to each other with a predetermined gap therebetween. A gas is flowed into the through-holes from one side of the pair of plate-like conductor parts. Plasma discharge is generated in the gap by applying a high-frequency voltage between the pair of plate-like conductor parts and the generated plasma is flowed out to the other side of the pair of plate-like conductor parts.

Abstract: A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.

Abstract: A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating.

Abstract: Provided are a technique with which a satin-like appearance can be obtained in nickel-plating by a nickel-plating additive characterized by containing a benzethonium salt, a satin nickel-plating bath containing the same, and a satin nickel-plating method using the same.

Abstract: Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate plating solutions in an objective manner is provided. A method for managing a copper sulfate plating solution used for performing copper sulfate plating for a material to be plated, the method containing: measuring a concentration of impurities in the copper sulfate plating solution; and assessing aging of the copper sulfate plating solution from the concentration of the impurities.

Abstract: A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section.