Abstract: There is disclosed a system and method for transferring waste heat from integrated circuits. In an embodiment, the system comprises: a self-contained enclosure having integrated circuits therein, the self-contained enclosure further including: a first fluid circuit configured for removing waste heat from the integrated circuits; an inlet for connection from an external water tank and an outlet for connection to the external water tank, that when connected with the external water tank forms a second fluid circuit; a heat exchanger operatively connected to the first fluid circuit and the second fluid circuit, and configured to transfer thermal energy therebetween; and a control for regulating a temperature gradient and a flow rate in each of the first and second fluid circuits, such that both a desired integrated circuit operating temperature and a desired water tank temperature is achieved.
Type:
Grant
Filed:
August 31, 2021
Date of Patent:
August 29, 2023
Assignee:
JDI Design Inc.
Inventors:
Adrian Albert van Wijk, Nikolas Lyman Henderson Radosevic
Abstract: There is disclosed a system and method for transferring waste heat from integrated circuits. In an embodiment, the system comprises: a self-contained enclosure having integrated circuits therein, the self-contained enclosure further including: a first fluid circuit configured for removing waste heat from the integrated circuits; an inlet for connection from an external water tank and an outlet for connection to the external water tank, that when connected with the external water tank forms a second fluid circuit; a heat exchanger operatively connected to the first fluid circuit and the second fluid circuit, and configured to transfer thermal energy therebetween; and a control for regulating a temperature gradient and a flow rate in each of the first and second fluid circuits, such that both a desired integrated circuit operating temperature and a desired water tank temperature is achieved.
Type:
Application
Filed:
August 31, 2021
Publication date:
December 8, 2022
Applicant:
JDI Design Inc.
Inventors:
Adrian Albert van Wijk, Nikolas Lyman Henderson Radosevic
Abstract: A fluent material dispensing system comprising: a bottle, a plunger engaged inside the bottle, and a dispensing mechanism having a lever for operation of the plunger for fluid expulsion. The plunger may frictionally engage the bottle to a degree sufficient for holding the plunger in place against a force applied due to return motion of the lever. The dispensing mechanism may comprise a cap for attachment to an end of the bottle opposite a fluid outlet and a handle attached to the cap, the lever pivotally coupled to the cap, the lever and the handle aligned with the bottle. The dispensing mechanism may comprise a portioning mechanism configured to limit distance travelled by the lever from the rest position to the engaged position to a defined amount, thereby limiting expulsion of the fluid to a corresponding defined portion.
Type:
Grant
Filed:
February 23, 2012
Date of Patent:
August 20, 2013
Assignee:
JDi Design Inc.
Inventors:
Adrian Albert Van Wijk, Samuel Charles Richards, James William McDonald