Abstract: An interconnection system for connecting leadless grid arrays of integrated circuits with leadless grid arrays of printed circuit boards. The system includes an insulative socket, flexible conductive elements and a compression lid. The insulative socket is temporarily affixed to the printed circuit board as the conductive elements, retained on a flexible carrier, are inserted into cavities of the socket. The cavities of the socket have inside dimensions greater than the outside dimensions of the conductive elements. After the conductive elements have been affixed to the printed circuit board, the flexible carrier is taken off of the elements and the insulative socket may be removed for visual inspection of the connection between the contact pads of the circuit board and the conductive elements. The integrated circuit is placed on top of the conductive elements such that contact pads of the circuit are properly aligned with appropriate contact pads of the printed circuit board.