Abstract: A method for the production of a diode laser having a laser bar, wherein a metal layer having raised areas is used which is located between the n-side of the laser bar and the cover. The metal layer can be plastically deformed during installation without volume compression in the solid physical state. As a result the laser module can be reliably installed and a slight deviation (smile value) of the emitters from a centre line is achieved.

Abstract: The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).

Abstract: A diode laser comprising a plurality of laser bars. The laser bars are constructed as a laser stack with heat conducting bodies arranged between the bars. The laser bars are arranged in an interior of a housing. The housing is formed from a frame fitted on the multilayer substrate and a window. The empty volume is less than half of the total volume of the interior.

Abstract: A method for the production of a diode laser having a laser bar, wherein a metal layer having raised areas is used which is located between the n-side of the laser bar and the cover. The metal layer can be plastically deformed during installation without volume compression in the solid physical state. As a result the laser module can be reliably installed and a slight deviation (smile value) of the emitters from a centre line is achieved.

Abstract: The invention relates to a transparent auxiliary ring for the adjustment, for the long-term stable operation and for protection of fiber-coupled laser arrangements.

Abstract: A device for beam shaping includes a heat dissipation body having an upper side with a planar section and a plurality of laser elements next to one another on the planar section of the upper side that respectively emit a ray bundle having a fast-axis divergence and, perpendicular thereto, a slow-axis divergence. A reflection element is arranged such that the ray bundles of the individual laser elements extend parallel to one another and at an elevation angle of greater than 0° and less than 90° with respect to the planar section after exactly one reflection at the associated reflection element. The reflected ray bundles are stacked in the optical path downstream of the reflection elements in a first plane perpendicular to the beam direction and a connecting line, lying in the first plane, of the centers of the reflected ray bundles extends perpendicular to the direction of the slow axis.

Abstract: A fiber coupler with an inner tube, an inner fiber arranged within the inner tube and several outer fibers arranged around the inner fiber, is disclosed, wherein said fiber coupler tapers in the longitudinal direction of the inner fiber from a main section to a terminal section and the inner cross section on the inner tube corresponds to the diameter of the inner fiber along the tapering section of the fiber coupler.

Abstract: A semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat conducting body each. The heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element. A spacer, which with regard to the third connection, is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the joining zone thickness of the third connection being greater than that of the first or the second joining zone to ensure that defined joining zone thicknesses in the bonded connection is maintained during the joining process. The third connection can be used for at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device.

Abstract: A device for beam shaping includes a heat dissipation body having an upper side with a planar section and a plurality of laser elements next to one another on the planar section of the upper side that respectively emit a ray bundle having a fast-axis divergence and, perpendicular thereto, a slow-axis divergence. A reflection element is arranged such that the ray bundles of the individual laser elements extend parallel to one another and at an elevation angle of greater than 0° and less than 90° with respect to the planar section after exactly one reflection at the associated reflection element. The reflected ray bundles are stacked in the optical path downstream of the reflection elements in a first plane perpendicular to the beam direction and a connecting line, lying in the first plane, of the centers of the reflected ray bundles extends perpendicular to the direction of the slow axis.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: The invention relates, among other things, to a method for the assembly of a semiconductor component, wherein the semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat-conducting body each. For this purpose, the heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element, wherein a spacer, which with regard to the third connection is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the requirement that the joining zone thickness of the third connection is greater than that of the first or the second joining zone, ensures that defined joining zone thicknesses in the bonded connection are maintained during the joining process.

Abstract: To produce a light transmission apparatus with a reference objective, an optical fiber having a light transmission surface and a retaining element, the invention proposes the production of a cutout in the retaining element by molding of one outer contour section of the optical fiber. The cutout is used for radial, form-locked control of a guide section of the optical fiber which slides in the cutout with respect to the retaining element in order to change the position of the light transmission surface. The locking of the layers of the retaining element and of the light transmission surface with respect to the reference objective concludes the positioning procedure of the light transmission surface with respect to the reference objective.

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.