Abstract: The present disclosure is related to a lead frame structure. The lead frame structure includes a bottom board and a blocking wall. The bottom board has a first conductive portion and a second conductive portion. The first conductive portion separates from the second conductive portion. The first and second conductive portions are configured to electrically connect to a light source. The blocking wall is located on the bottom board, and the blocking wall surrounds an opening. The first and the second conductive portions are exposed from the opening. The first and the second conductive portions each have an extending portion. The extending portion extends beyond an external surface of the blocking wall in a horizontal direction.

Abstract: A vapor chamber includes a main body. The main body includes a base plate and a top plate. The base plate includes a plate body, a peripheral frame and a plurality of supporting pillars. The plate body has a surface. The peripheral frame is disposed on the surface of the plate body. The surface and the peripheral frame together define a first space. The first space is configured to accommodate a working fluid. The supporting pillars are located in the first space and are distributed on the surface of the plate body. The supporting pillars, the plate body and the peripheral frame are of an integrally-formed structure. The top plate abuts against the peripheral frame and the supporting pillars to seal up the first space.

Abstract: A packaging method of heat spreaders includes the following steps. Arrange a plurality of heat spreaders and a plurality of gaskets alternately to a container, wherein at least one of the gaskets is arranged between any immediately-adjacent two of the most adjacent heat spreaders. Remove all of the gaskets from the container at the same time. A packaging box suitable for this packaging method is also provided.

Abstract: A light emitting diode module includes a first conductive device, a second conductive device, an insulating structure and a plating layer. The first conductive device includes a first metal layer and a first protecting layer covering the first metal layer. The second conductive device includes a second metal layer and a second protecting layer covering the second metal layer. The insulating structure covers around the first and the second conductive devices. The plating layer is disposed on the first and the second protecting layers in a first and a second openings of the insulating structure. The insulating structure covers portions of upper surfaces of the first and the second conductive devices. The plating layer covers remaining portions of the upper surfaces of the first and the second conductive devices. Lower surfaces of the first and the second conductive devices are located in the second opening.

Abstract: A heat spreading plate is suitable to be a top cover of a chip package structure. The heat spreading plate includes a main body and an isolating frame. The main body includes a plurality of metal sheets which are arranged spaced apart from one another totally and capable of thermally connecting different working chips mounted within the chip package structure, respectively. A gap is formed between any two neighboring ones of the metal sheets to completely separate them. The isolating frame surrounds the outer edges of the metal sheets and fills into the gaps for fixedly holding the metal sheets together. One surface of the isolating frame is formed with a plurality of hollow recesses, and each of the metal sheets is exposed outwards from one of the hollow recesses.

Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.

Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.

Abstract: The present invention provides a plastic unit internally embedded with an antenna and a manufacturing method of the same. The manufacturing method comprises the steps of preparing a plastic housing, installing an antenna metal wiring on the plastic housing, and covering a heated and softened thermoplastic material on the antenna metal wiring and the plastic housing. The cooled thermoplastic material and the plastic housing are combined as a plastic member. The antenna metal wiring is internally embedded in the plastic member.