Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Abstract: Improved cooling modules and methods are configured to recirculate the liquid coolant fluid inside the cooling modules so that the same liquid cooling fluid impinges the surfaces of the heat-generating electronic components (or cooling plates in thermal communication with the heat-generating electronic components) multiple times before exiting the cooling module, thereby allowing a given flow of coolant fluid to be re-used several times over. With each re-use of the coolant fluid, the flow rate demand drops, reducing infrastructure required to achieve higher performance in direct and indirect micro-convective impingement cooling applications.

Abstract: An electronics assembly in which microjet nozzles are co-located with electronic elements on the same substrate or layer. This technique may be used to integrate lower power-density electronics onto an existing microjet nozzle plate to perform microjet nozzle cooling, which removes the need for separate thermal management solutions for systems that contain both high and lower power-density elements in proximity. This technique may also be used in multilayered 3D integrated electronic substrates, allowing for thin, high performing thermal management solutions in 3D integrated stackups using microjets.

Abstract: An immersion cooling assembly comprises at least one primary heat-generating electronic component and a flow-through cooling module mounted near the at least one primary heat-generating component. The flow-through cooling module comprises at least one inlet conduit to accept an inflow of pressurized dielectric coolant, a fluid chamber through which fluid flows to provide targeted, direct cooling to a heat-generating component, and exit passageways to facilitate flow-through of the dielectric coolant into a surrounding immersion bath for cooling of other components. As it flows out of the cooling module and over the heat-generating component, the coolant fluid absorbs heat from the heat-generating electronic component. In certain embodiments, the assembly may also comprise at least one periphery heat-generating electronic component, which may also be cooled by the dielectric coolant as it exits the vicinity of the flow-through cooling module.

Abstract: Embodiments of the present invention provide a cooling module for cooling heat-generating electronic devices in an immersion cooling system. The cooling module includes an integrated pump, which draws immersion fluid from the surrounding dielectric bath and drives it into a pressurized plenum to pressurize the coolant fluid and drive the pressurized coolant fluid through a nozzle plate containing a microconvective nozzle array. The array accelerates the fluid to produce a multiplicity of microjets that impinge on a surface of the heat-generating electronic device to be cooled. The effluent from the cooling module may be directed to flow into and wash over nearby heat-generating devices to help cool the nearby heat-generating devices. The effluent may also be directed to the inlets of daughter cooling modules attached to other heat-generating electronic devices.

Abstract: Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the printed circuit board or processor assembly, and thereby defining a device chamber for the heat-generating devices on the printed circuit board to reside. A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, wherein the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber that is adjacent to the device chamber, the fluid chamber being configured to prevent any cooling fluid flowing therethrough to enter the adjacent device chamber.

Abstract: Embodiments of the present invention provide a cooling module for cooling heat-generating electronic devices in an immersion cooling system. The cooling module includes an integrated pump, which draws immersion fluid from the surrounding dielectric bath and drives it into a pressurized plenum to pressurize the coolant fluid and drive the pressurized coolant fluid through a nozzle plate containing a microconvective nozzle array. The array accelerates the fluid to produce a multiplicity of microjets that impinge on a surface of the heat-generating electronic device to be cooled. The effluent from the cooling module may be directed to flow into and wash over nearby heat-generating devices to help cool the nearby heat-generating devices. The effluent may also be directed to the inlets of daughter cooling modules attached to other heat-generating electronic devices.

Abstract: A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.

Abstract: A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.

Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Abstract: A ship-and-install electronics assembly with multifunctional interface chassis and liquid-fluid heat exchange. A liquid-fluid loop subassembly contains a pump, a liquid cooling implement, a liquid-fluid heat exchanger, and fluid conveyance components. An electrical circuit subassembly contains a heat-generating component. A multifunctional interface chassis facilitates at least two of structural, electrical power, electrical sensor signal, and network communication between the assembly and corresponding fixtures external to the assembly. Allows for implementation of high density heat-generating electronic components with liquid cooling in a modular form factor that is easy for end users to install and operate.

Abstract: Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the printed circuit board or processor assembly, and thereby defining a device chamber for the heat-generating devices on the printed circuit board to reside. A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, wherein the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber that is adjacent to the device chamber, the fluid chamber being configured to prevent any cooling fluid flowing therethrough to enter the adjacent device chamber.

Abstract: A cooling system and method of cooling electronic components comprising a tank (or other vessel) in which a dielectric liquid cools low power electronic components within the tank, while a conductive liquid cools high power electronic components in the tank. The conductive liquid is supplied via a plurality of cooling modules, each arranged on or in proximity to a high power component. A cooling module arranged within the tank may enclose one or more of the electronic components in the tank using a fluid-tight seal.

Abstract: An immersion cooling assembly comprises at least one primary heat-generating electronic component and a flow-through cooling module mounted near the at least one primary heat-generating component. The flow-through cooling module comprises at least one inlet conduit to accept an inflow of pressurized dielectric coolant, a fluid chamber through which fluid flows to provide targeted, direct cooling to a heat-generating component, and exit passageways to facilitate flow-through of the dielectric coolant into a surrounding immersion bath for cooling of other components. As it flows out of the cooling module and over the heat-generating component, the coolant fluid absorbs heat from the heat-generating electronic component. In certain embodiments, the assembly may also comprise at least one periphery heat-generating electronic component, which may also be cooled by the dielectric coolant as it exits the vicinity of the flow-through cooling module.

Abstract: A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.

Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Abstract: A conformal cooling assembly for multiple-die electronic assemblies, such as printed circuit boards, integrated circuits, etc., which addresses and solves a multitude of challenges and problems associated with using liquid-cooled cold plates and dielectric immersion cooling to manage the heat produced by a multiplicity of dies. The conformal cooling assembly comprises a conformal cooling module comprising inlet and outlet passageways and a plenum configured to permit a cooling fluid to pass therethrough, thereby facilitating direct fluid contact with heat-generating components affixed to the substrate of the electronic assembly. The conformal cooling assembly also includes a fastener for attaching the conformal cooling module to the substrate; and a fluid-barrier disposed between the substrate and the plenum. The fluid-barrier is adapted to minimize, inhibit or prevent the cooling fluid from penetrating and being absorbed by the substrate.

Abstract: A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.

Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.