Patents Assigned to Jetek, LLC
  • Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes
    Patent number: 7365019
    Abstract: A system that generates an intense hot gas stream is described to etch a polymer on a substrate used in the manufacture of semiconductor and MEMS devices with no surface damage. The etching process is particularly useful to remove a polymer from relatively high aspect Height-to-Width and Width-to-Height ratio holes that can include trenches, having relatively large aspect ratios for removal of polymers used in connection with the manufacturing of microstructures.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: April 29, 2008
    Assignee: Jetek, LLC
    Inventors: Lynn David Bollinger, Iskander Tokmouline