Abstract: An anisotropic conductive film bonding apparatus and a method using a laser beam instead of thermal welding using a hot bar are disclosed. The apparatus includes a light source for generating a laser beam, a laser beam transmitter for guiding the laser beam from the light source to project the laser beam onto a connecting portion, a jig, on which the substrate, the ACF, and the material are accumulated, for projecting the laser beam on the accumulated material, a manipulation panel, and a controller for setting intensity and projection manner of the laser beam and pressure and for controlling overall operation of the apparatus.

Abstract: A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at industrial scale. By improving the structure of a finger for a feeder belt including a belt body, the separation, fatigue, and the sliding of the finger during feeding of the strip-shaped parts is resolved. Since external force can be applied in the horizontal direction when loading and unloading the strip-shaped parts, peripheral devices are simplified.

Abstract: A feed belt for strip-shaped elements includes a belt body and a plurality of fingers, the fingers being previously fabricated and coupled to the belt body at constant pitches. The belt body includes fitting openings and slits formed at one side of the fitting openings. Each fitting opening serves to be coupled with a fitting portion and an elastic hinge portion formed at one side of each finger. Each slit serves to be coupled with a bent gripper portion formed at the other side of the finger so as to allow movement of the bent gripper portion. The fitting portion and the elastic hinge portion of the finger, to be coupled into the fitting opening, are integrally formed. The bent gripper portion to be fitted into the slit is integrally connected with the elastic hinge portion through a direction conversion portion.

Abstract: A fan jet nozzle for use with an ultra high pressure liquid-phase cleaning media for use in a deflashing apparatus includes a nozzle tip, which is made of a super hard material such as diamond, and is secured inside a nozzle holder through sintering. Upper and lower nozzle bores above and beneath the nozzle tip are processed to converge and communicate with each other inside the nozzle tip, resulting in a center nozzle hole having an elliptical shape. One of the upper and lower nozzle bores is processed into a circular cone shape, and the other one of the upper and lower nozzle bores is processed to have an arched longitudinal sectional shape and a cross sectional shape wherein its width increases toward a center thereof and decreases toward both sides thereof.

Abstract: Disclosed herein is a deflash technique for removing flash from a portion of a semiconductor package to be plated before a plating process and after a sealing process accompanied by resin molding during the manufacture of semiconductors, and more particularly a semiconductor package having grooves formed at side flash, a groove forming method, and a deflshing method using the semiconductor package, for removing the side flash formed at a side portion of a lead frame where it is difficult to perform a deflashing process. Conventionally, it is impossible to completely remove side flash remaining on the lead frame at a region where it is difficult to perform a deflashing process even by injecting water jet or media at a very high pressure, or by irradiating laser beams thereto while changing irradiation directions.