Patents Assigned to JF Microtechnology Sdn. Bhd.
  • Patent number: 12618899
    Abstract: A method of aligning one or more rows of contact pins in an integrated circuit (IC) device testing apparatus that uses structures in bottom plates of the assembly itself to align rows of contact pins. Once a row of contact pins has been inserted into slots located on a socket body in the y-axis, one of the bottom plates is lowered onto the socket body. Some structures on the bottom plate restrict it to movement primarily in the x-axis with respect to the socket body, while other structures allow it to capture all misaligned contact pins and “comb” them into alignment by small adjustments in the x-axis. In this way, the rows of contact pins are aligned as part of the assembly process itself, and no additional tools or equipment are needed.
    Type: Grant
    Filed: March 25, 2023
    Date of Patent: May 5, 2026
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Caleb Lim
  • Publication number: 20260072077
    Abstract: An electrical contact for electrically connecting a device pin of an integrated circuit (IC) device-under-test and a load board of the testing apparatus, the electrical contact having a crossed pair of contact pins with each pin having a pair of upwards-extending arms that intersect perpendicularly the pair of arms of the other pin, so that all four arms form a square configuration, with each arm at a 90° angle to the arm next to it. A top pin has a bridge that saddles between the arms, and over a shoulder of the bottom pin, so that the top and bottom pins are not in contact with each other.
    Type: Application
    Filed: April 11, 2025
    Publication date: March 12, 2026
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE, Kee Shan GOH
  • Publication number: 20240280607
    Abstract: An electrical contact terminal in a testing apparatus that is provided with dual contacts, one for force and the other for sense. This allows both force and sense contacts to establish an electrical connection with the device pin, even when the device pin has a lateral deviation from its desired position. The present invention also teaches of a method of assembly of the contact terminal that overcomes the space constraint that results from having two contacts instead of just one in the given space.
    Type: Application
    Filed: February 20, 2024
    Publication date: August 22, 2024
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE
  • Publication number: 20240159796
    Abstract: A vertical spring contact that is constructed of a single piece of electrical conductor, having a central compressible spine that acts as a spring. This contact is also provided with a pair of arms extending downwards from a top member, flanking both sides of the central spine without being in contact with the central spine. The central spine structurally connects the top member to a bottom member. The bottom member is provided with recesses that are adapted to loosely receive the lower tips of the arms. In this way, when the contact is compressed, the lower tips of the arms are pressed into the recesses, thus establishing more contact points for a current to pass through.
    Type: Application
    Filed: November 10, 2023
    Publication date: May 16, 2024
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE, Grace Ann Nee YEE
  • Patent number: 11821916
    Abstract: An electrical ground connector for use as part of a test connector in an integrated circuit (IC) device testing apparatus having a resilient connector for electrical grounding and comprising a dual elastomer contact stacked vertically above a rigid ground block. The height of the ground block can be adjusted to compensate for the lack of height of the dual elastomer contacts, so that the entire connector has enough height to maintain electrical connection between a load board of the testing apparatus and the IC device.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: November 21, 2023
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Fadzhirul Ridhzwan Azry Bin Sulaiman
  • Publication number: 20230314501
    Abstract: A method of aligning one or more rows of contact pins in an integrated circuit (IC) device testing apparatus that uses structures in bottom plates of the assembly itself to align rows of contact pins. Once a row of contact pins has been inserted into slots located on a socket body in the y-axis, one of the bottom plates is lowered onto the socket body. Some structures on the bottom plate restrict it to movement primarily in the x-axis with respect to the socket body, while other structures allow it to capture all misaligned contact pins and “comb” them into alignment by small adjustments in the x-axis. In this way, the rows of contact pins are aligned as part of the assembly process itself, and no additional tools or equipment are needed.
    Type: Application
    Filed: March 25, 2023
    Publication date: October 5, 2023
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE, Caleb LIM
  • Patent number: 11696396
    Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: July 4, 2023
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Grace Ann Nee Yee
  • Publication number: 20220317152
    Abstract: An electrical ground connector for use as part of a test connector in an integrated circuit (IC) device testing apparatus having a resilient connector for electrical grounding and comprising a dual elastomer contact stacked vertically above a rigid ground block. The height of the ground block can be adjusted to compensate for the lack of height of the dual elastomer contacts, so that the entire connector has enough height to maintain electrical connection between a load board of the testing apparatus and the IC device.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 6, 2022
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE, Fadzhirul Ridhzwan Azry Bin SULAIMAN
  • Patent number: 11266015
    Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 1, 2022
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Grace Ann Nee Yee
  • Publication number: 20200393511
    Abstract: An IC testing apparatus whereby a wedge body with inclined surfaces is attached to a bottom side of existing contact finger modules. The inclined support is then attached to the top of a load board of the testing apparatus. The inclined surfaces cause the normally horizontal finger modules to become inclined to the horizontal. In this manner, testing can be carried out in the usual way with existing contact finger modules, whilst the problems of IC device contact pad burr and oxidization are solved. Furthermore, because the outer, load board end of the contact fingers are also at an angle, these outer tips of the contact fingers naturally come into contact with the load board, without requiring any soldering.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 17, 2020
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE, Muhamad Izzat bin ROSLEE, Mei Chen CHIN
  • Patent number: 10830812
    Abstract: A manufacturing process for an electrical contact assembly that uses an assembly jig with a middle horizontal lip adapted to fit into a plurality of C-shaped inner contact pins, as well as top and bottom guide teeth that guide top and bottom parts of the inner pins as they are being assembled. An inner holder then covers the inner pins, at which point epoxy is applied, which when cured, secures the inner holder to the plurality of inner pins. Outer contact pins in turn cover the outside of the inner holder, and an outer holder covers the outer contact pins. Epoxy is also applied between the outer holder and outer pins, which when cured, secures the outer holder to the plurality of outer pins. A heat curing process is also employed to assist with the curing of the epoxy, during which a clamp temporarily holds the assembly in place.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: November 10, 2020
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee
  • Patent number: 10826217
    Abstract: An electrical contact assembly having a pair of contacts mirroring each other, each contact coupled with an elastomer positioned in a recess formed near a lower end of the contact. Each elastomer has a cylindrical shape with the axis of the cylinder running in a front to rear direction. Each elastomer is secured at its front and rear ends by a lower cavity formed within a housing. The contacts are able to rock sideways around their lower ends between uncompressed and compressed states.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 3, 2020
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Muhamad Izzat bin Roslee
  • Patent number: 10578645
    Abstract: An electrical contact for use in an integrated circuit testing apparatus having an elongated electrically conductive contact pin with a contact tip facing upwards at an inner end of the contact pin, a curved bottom surface that allows the contact pin to rock and slide from side to side during testing. An elongated compressible member with a “P-shaped” cross section, with a “vertical portion” which is the upper, curved part of the so-called letter “P” shape adapted to fit snugly within an upward-facing recess on a top part of the contact pin, and a “horizontal portion” which is the trunk or vertical line of the so-called letter “P” shape positions in between and in contact with a lower top surface of the contact pin and a socket roof.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: March 3, 2020
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee
  • Publication number: 20200064371
    Abstract: An electrical contact for use in an integrated circuit testing apparatus having an elongated electrically conductive contact pin with a contact tip facing upwards at an inner end of the contact pin, a curved bottom surface that allows the contact pin to rock and slide from side to side during testing. An elongated compressible member with a “P-shaped” cross section, with a “vertical portion” which is the upper, curved part of the so-called letter “P” shape adapted to fit snugly within an upward-facing recess on a top part of the contact pin, and a “horizontal portion” which is the trunk or vertical line of the so-called letter “P” shape positions in between and in contact with a lower top surface of the contact pin and a socket roof.
    Type: Application
    Filed: October 31, 2019
    Publication date: February 27, 2020
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE
  • Patent number: 10527646
    Abstract: An electrical contact assembly comprised of four identical modules arranged in a four-sided formation. Each module comprises of a bottom housing formed with two rows of through holes to allow a row of front and back contact pairs to be inserted, with separators in between each pair to prevent electrical conductance between the pairs. A top housing is then lowered onto the top of these contact pairs. With the aid of a key tool, the rows of contact pairs are inserted into through holes in the top housing. By virtue of different heights between the front and back rows of through holes, the front and back contact rows are inserted one first, and then the other. This allows for easier installation of an assembly with minimal tolerance accumulation.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: January 7, 2020
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee
  • Patent number: 10488439
    Abstract: An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact whilst compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 26, 2019
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee
  • Patent number: 10466300
    Abstract: A top housing having a back slot and a front slot parallel with each other, and both stacked on top of a row of lower slots, which is perpendicular to the back and front slots. In this way, the juxtaposition of the back and front slots and the row of lower slots forms two rows of virtual rectangular through-openings. The back of these rows receives a row of first contacts extended through them. The front of these rows receives a row of second contacts extended through them. The through-openings thus guide the contacts at a position of the contacts that is very close to where they contact the lead of the DUT. Hence, there is a very high amount of precision and control of the contact tip that contacts the lead of the DUT.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: November 5, 2019
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Mei Chen Chin
  • Patent number: 10446965
    Abstract: A vertical spring contact is constructed of a single piece of electrical conductor, having a central spine that acts as a spring and does not bulge horizontally during compression. This contact is also provided with a pair of arms extending downwards from a top member, flanking both sides of the central spine without being in contact with the central spine. The lower tips of the arms are bent inwards. The central spine structurally connects the top member to a bottom member. The bottom member is provided with recesses that are adapted to loosely receive the lower tips of the arms. In this way, when the contact is compressed, the lower tips of the arms are pressed into the recesses, thus establishing more contact points for a current to pass through.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: October 15, 2019
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee
  • Publication number: 20190267738
    Abstract: An electrical contact assembly having a pair of contacts mirroring each other, each contact coupled with an elastomer positioned in a recess formed near a lower end of the contact. Each elastomer has a cylindrical shape with the axis of the cylinder running in a front to rear direction. Each elastomer is secured at its front and rear ends by a lower cavity formed within a housing. The contacts are able to rock sideways around their lower ends between uncompressed and compressed states.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE, Muhamad Izzat bin ROSLEE
  • Publication number: 20190067861
    Abstract: An electrical contact test assembly that has a small size, a very low inductance, is able to handle high frequency and high current testing, and one that is easy to assemble, handle and maintain. An electrical contact assembly that comprises a shorter length of contact achieved by sandwiching an inner holder in between two rows of contacts and keeping them together via an adhesive between each of the two rows of contacts and the inner holder. In this way, very small sizes of contacts are more easily assembled and handled. The low inductance then allows for high frequency testing. An electrical contact assembly that comprises a one-piece contact without the complexity of other designs such as screws, springs, etc, allowing higher currents and tri-temperature testing.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Applicant: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong FOONG, Kok Sing GOH, Shamal MUNDIYATH, Eng Kiat LEE