Abstract: Disclosed are devices for making a bond between a wire and a substrate at a point, and to methods of making the bond. The device includes in particular a pressure foot, a base for supporting the substrate, a delivery source for delivering the wire, the pressure foot being suitable for occupying at least two positions that are respectively closer to and further from the base, the wire delivered by the source being suitable for passing between the pressure foot and the base, a presser finger suitable for occupying two positions respectively closer to and further from the base, an element for mounting the pressure foot and the presser finger to co-operate with the base in such a manner that they define between them a bonding space containing the point, and spot-bonding element suitable for acting at the point.