Abstract: Polishing media in the form of bristles made from a porous polymer-based material, apparatus and systems including the media, and methods of forming and using the media, apparatus, and systems are disclosed. A method of manufacturing bristles for use in polishing a workpiece which includes a non-planar surface includes the steps of combining a liquid polymer material and a foaming agent to form a foamed polymeric material, and separating the foamed polymeric material into a plurality of bristles. The foaming agent is configured to impart a porosity to the polymeric material, where the porosity is characterized by a density in the range of 0.3 to 1.2 g/cm3.

Abstract: A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.

Abstract: Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments:soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields.

Abstract: A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.

Abstract: A polishing pad, for polishing of a work piece having portions that are non-planar, the polishing pad comprising a first side and a second side of the polishing pad. The first side is substantially flat, and the second side is configured to polish the non-planar work piece. The polishing pad further comprises a concentric annular channel in the polishing pad, wherein the concentric annular channel comprises a channel surface, wherein the second side of the polishing pad comprises an inner surface, the channel surface, and an outer surface, and wherein the channel surface is recessed relative to the inner surface and outer surface. The polishing pad further comprises a plurality of islands located within the concentric annular channel, wherein the islands comprise an island surface that is raised relative to the channel surface.

Abstract: The present invention is directed to a self-conditioning polishing pad. The self-conditioning polishing pad comprises an insoluble polymeric foam matrix and insoluble polymeric foam particles within the foam matrix. The particles are coated with a water-soluble component over a portion of the surface area of the particle. The particles may have a diameter in the range of 5 to 1000 microns in diameter.

Abstract: The present invention is directed to a self conditioning polishing pad. The self-conditioning polishing pad comprises an insoluble polymeric foam matrix and insoluble polymeric foam particles within the foam matrix. The particles are coated with a water-soluble component over a portion of the surface area of the particle. The particles may have a diameter in the range of 5 to 1000 microns in diameter.

Abstract: A method of improving a removal rate of a pad includes producing a body of a pad of polyurethane from a mix; and introducing into the mix an additive which decreases an elastic rebound of the pad so as to increase a chemical-mechanical planarization removal rate; and using as the additive a substance which at least contains starch. In another embodiment, in a CMP process that includes removing a barrier and buffing a polyurethane after a bulk copper removal process, a polishing pad is used having a shore D hardness less than 35% and having at least one layer made from a mix composed of at least one of a prepolymer with an isocyanate concentration of between 6.5% and 11.0% to achieve a molal concentration, and a monomer in combination with an addition of isocyanate to achieve the substantially same molal concentration.

Abstract: A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad said grooves extend in all directions in the plane of the working surface. Such an arrangement of grooves is the optimum configuration for CMP, especially copper CMP.

Abstract: A polishing pad has a sublayer; a top layer attached to the sublayer, the sublayer having a modulus of elasticity between 300 and 5000 psi and a compressibility of less than 30% at 73 psi, wherein the top pad has a modulus of elasticity which is greater than the modulus of elasticity of the sublayer and a compressibility which is smaller than a compressibility of the sublayer.