Abstract: Provided by the invention disclosure is a coating equipment. The coating equipment comprises a reaction chamber body provided with a reaction chamber, a gas supply part configured to supply gas to the reaction chamber, a pumping device configured to communicate with the reaction chamber, a pulse power supply adapted to provide the reaction chamber body with a pulsed electric field and a radio frequency power supply adapted to provide the reaction chamber body with a radio frequency electric field, wherein the reaction chamber is adapted to accommodate a plurality of workpiece. When the pulse power supply and the radio frequency power supply are turned on, the gas in the reaction chamber body is ionized under the radio frequency electric field and the pulsed electric field to generate plasma, and the plasma is deposited on the surface of the workpieces.

Abstract: A DLC preparation apparatus and a preparation method. The DLC preparation apparatus comprises a body (10), a plasma source unit (50), and at least one gas supplying part (20). The body (10) is provided with a reaction chamber (100). The reaction chamber (100) is used for placing a substrate. The gas supplying part (20) is used for supplying a reaction gas to the reaction chamber (100). The plasma source unit (50) is provided outside of the body (10) and provides a radiofrequency electric field to the reaction chamber (100) to promote the generation of plasma, thus allowing the reaction gas to be deposited on the surface of the substrate by means of PECVD to form a DLC film.

Abstract: Provided in the present disclosure are a coating method and a film layer thereof, and a coating chucking appliance and an application thereof. The coating method comprises the steps of: forming a normal film layer on a first component on a substrate surface, and forming at least a thinner film layer on a second component on the substrate surface, wherein the thickness of the normal film layer is greater than the thickness of the thinner film layer. The coating method can prepare a thinner film layer on the surface of some portions or parts on the substrate surface, and prepare a thicker film layer on the surface of other portions or parts, thereby satisfying the requirements of coating a thinner film layer on some electronic components of the substrate, such as circuit interface components, ensuring data transmission performance.

Abstract: The present invention provides a hydrophobic surface coating and a preparation method therefor. The hydrophobic surface coating uses one or more fluorinated alcohol compounds as a reaction gas material, and is formed on a surface of a base body by a plasma-enhanced chemical vapor deposition method, to improve the hydrophobicity, the chemical resistance, and the weatherability of the surface of the base body.

Abstract: The present disclosure provides a water-resistant nanofilm, a preparation method and an article thereof, in which fluorocarbon gas is used as a plasma source and is formed on a substrate surface of substrate by a plasma enhanced chemical vapor deposition method, so that the water-resistance performance of the substrate surface is improved.

Abstract: Methods and associated systems for preparing a nano-protective coating are disclosed. The method includes (1) placing a substrate in a reaction chamber of a nano-coating preparation equipment; (2) introducing an inert gas, wherein the inert gas includes helium (He) and/or argon (Ar); (3) turning on a movement mechanism so that the substrate is moved in the reaction chamber; (4) introducing a first monomer vapor into the reaction chamber to achieve a vacuum degree of 30-300 mTorr; (5) turning on a plasma discharge for chemical vapor deposition; and (6) introducing a second monomer vapor into the reaction chamber to form an organosilicon nano-coating on a surface of the substrate.

Abstract: Introduced here is a plasma polymerization apparatus. Example embodiments include a reaction chamber in a shape substantially symmetrical to a central axis. Some examples further include a rotation rack in the reaction chamber. The rotation rack may be operable to rotate relative to the reaction chamber about the central axis of the reaction chamber. Examples may further include reactive species discharge mechanisms positioned around a perimeter of the reaction chamber and configured to disperse reactive species into the reaction chamber in a substantially symmetrical manner from the outer perimeter of the reaction chamber toward the central axis of the reaction chamber, such that the reactive species form a polymeric coating on surfaces of the one or more substrates during said dispersion of the reactive species, and a collecting tube positioned along the central axis of the reaction chamber and having an air pressure lower than the reaction chamber.

Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape relative to a central axis. A primary rotation shaft may be operable to rotate about the central axis of the vacuum chamber and a secondary rotation shaft may be operable to rotate about a secondary axis distal to the central axis. The primary and secondary rotation shafts may be mechanically connected, and one or more devices may be secured on a platform that rotates along both shafts. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a uniform polymeric multi-layer coating on the surface of the one or more devices.

Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Abstract: Methods and apparatus for preparing a protective coating are described. In one example aspect, an apparatus for preparing a protective coating includes a chamber, a substrate positioned within the chamber configured to hold at least a target object, an inlet pipe configured to direct a monomer vapor into the chamber, and one or more electrodes configured to perform a chemical vapor deposition process to produce a multi-layer coating. The chemical vapor deposition process comprises multiple cycles, each cycle comprising a pretreatment phase and a coating phase to produce a layer of the multi-layer coating.

Abstract: Methods and associated systems for preparing a nano-protective coating are disclosed. The method includes (1) placing a substrate in a reaction chamber of a nano-coating preparation equipment; (2) introducing an inert gas, wherein the inert gas includes helium (He) and/or argon (Ar); (3) turning on a movement mechanism so that the substrate is moved in the reaction chamber; (4) introducing a monomer vapor into the reaction chamber to achieve a vacuum degree of 30-300 mTorr; and (5) turning on a plasma discharge for chemical vapor deposition to form an organosilicon nano-coating on a surface of the substrate.

Abstract: An apparatus and a method for surface coating by means of grid control and plasma-initiated gas-phase polymerization. The method comprises: dividing a vacuum chamber into a discharging cavity (2) and a processing chamber (3) by using a metal grid mesh (1), the metal grid mesh (1) being insulated from the vacuum chamber; separately feeding carrier gas and monomer steam into the discharging cavity (2) and the processing chamber (3) through different pipes (4, 5), putting a substrate to be processed (11) in the processing chamber (3), and generating in the discharging cavity (2) plasma that continuously discharges; and applying pulse positive bias to the metal grid mesh (1), to release the plasma into the processing chamber (3) to initiate monomer polymerization.

Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

Abstract: A multi-source low-power low-temperature plasma polymerized coating device and method belong to the technical field of plasma. In the device, a plurality of discharge cavities are mounted on the wall of a main vacuum chamber; a plane grounding grid mesh and a porous electrode plate are mounted in each discharge cavity; and the porous electrode plate is parallel to the grid mesh, keeps a gap with the grid mesh and is connected with a low-power high-frequency power source. A carrier gas pipeline and a monomer steam pipeline are respectively connected to each discharge cavity. To-be-treated base material is placed in the main vacuum chamber. The vacuum pump is started to feed carrier gas and monomer steam.

Abstract: Introduced here is a plasma polymerization apparatus. Example embodiments include a reaction chamber in a shape substantially symmetrical to a central axis. Some examples further include a rotation rack in the reaction chamber. The rotation rack may be operable to rotate relative to the reaction chamber about the central axis of the reaction chamber. Examples may further include two reactive species discharge mechanisms positioned around a perimeter of the reaction chamber and configured to disperse reactive species into the reaction chamber in a substantially symmetrical manner from the outer perimeter of the reaction chamber toward the central axis of the reaction chamber, such that the reactive species form a polymeric coating on surfaces of the one or more substrates during said dispersion of the reactive species, and a collecting tube positioned along the central axis of the reaction chamber and having an air pressure lower than the reaction chamber.

Abstract: An apparatus and a method for surface coating by means of grid control and plasma-initiated gas-phase polymerization. The method comprises: dividing a vacuum chamber into a discharging cavity and a processing chamber by using a metal grid mesh, the metal grid mesh being insulated from the vacuum chamber; separately feeding carrier gas and monomer steam into the discharging cavity and the processing chamber through different pipes, putting a substrate to be processed in the processing chamber, and generating in the discharging cavity plasma that continuously discharges; and applying pulse positive bias to the metal grid mesh, to release the plasma into the processing chamber to initiate monomer polymerization.