Abstract: A hot-pressing device and process for an ACF bonding structure are provided. The hot-pressing device includes a transfer module and a first mounting plate connected to the transfer module. A negative-pressure adsorption module, at least one positioning module, and a lifting module are arranged on the first mounting plate. Pressing modules with hot-pressing assemblies are arranged at four corners close to the first mounting plate. Cleaning modules corresponding to the pressing modules are arranged in the transfer module below the first mounting plate. The present disclosure can quickly remove glue overflowing on a heat conduction element in the hot-pressing module by the cleaning module to ensure the surface flatness of a second part of the heat conduction element for hot-pressing and satisfactory resistance of an ACF connected to a substrate after hot-pressing.

Abstract: A preparation device and a process for an anisotropic conductive film (ACF) bonding structure are provided. The preparation device includes a negative-pressure adsorption device, a positioning assembly, and a hot-pressing module, where the negative-pressure adsorption device is configured to adsorb a first metal plate; the positioning assembly includes a first positioning module, at least two second positioning modules, and at least one third positioning module; and the hot-pressing module is configured to release a hot-pressing pressure, such that the second metal plate is connected to the first metal plate through an ACF to form a bonding structure. The present disclosure ensures reference positioning of the negative-pressure adsorption device on a mounting plate through the second positioning modules. The present disclosure further ensures that a side of the first metal plate is fully adhered to a side surface of an adsorption plate through the first positioning module.

Abstract: A preparation device and a process for an anisotropic conductive film (ACF) bonding structure are provided. The preparation device includes a negative-pressure adsorption device, a positioning assembly, and a hot-pressing module, where the negative-pressure adsorption device is configured to adsorb a first metal plate; the positioning assembly includes a first positioning module, at least two second positioning modules, and at least one third positioning module; and the hot-pressing module is configured to release a hot-pressing pressure, such that the second metal plate is connected to the first metal plate through an ACF to form a bonding structure. The present disclosure ensures reference positioning of the negative-pressure adsorption device on a mounting plate through the second positioning modules. The present disclosure further ensures that a side of the first metal plate is fully adhered to a side surface of an adsorption plate through the first positioning module.

Abstract: A hot-pressing device and process for an ACF bonding structure are provided. The hot-pressing device includes a transfer module and a first mounting plate connected to the transfer module. A negative-pressure adsorption module, at least one positioning module, and a lifting module are arranged on the first mounting plate. Pressing modules with hot-pressing assemblies are arranged at four corners close to the first mounting plate. Cleaning modules corresponding to the pressing modules are arranged in the transfer module below the first mounting plate. The present disclosure can quickly remove glue overflowing on a heat conduction element in the hot-pressing module by the cleaning module to ensure the surface flatness of a second part of the heat conduction element for hot-pressing and satisfactory resistance of an ACF connected to a substrate after hot-pressing.

Abstract: An anisotropic conductive film (ACF) structure and a hot-pressing method and a hot-pressing assembly thereof are provided. The ACF structure includes an ACF and a copper/gold foil surface layer as a substrate. The ACF structure is hot-pressed by a hot-pressing method, which includes the following steps: allowing, when the ACF is in a molten state, the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to conductive particles inside the ACF; and applying, when the ACF is in a curing stage, a closed circuit to ends of the copper/gold foil surface layer and the bonded part to perform real-time detection on the ACF to ensure the effectiveness of the hot pressing.