Abstract: Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, adding catalysis, activating, drying, spraying non-conducting paint on a first surface of the material, accelerating, forming an electroless copper plating layer on a second surface of the material, activating, forming an electroless nickel plating layer on the second surface of the material, sealing, dehydrating, drying, inspecting, and packing. Wherein, the steps of spraying non-conducting paint and drying give the material a beautiful painted appearance on the first surface thereof. The non-conducting paint on the first surface of the material facilitates easy formation of smooth electroless copper and nickel plating layers on the second surface of the material. Therefore, a product of the method can be used in electronic products requiring high sensitivity.