Patents Assigned to Jing Qiao Corporation Limited
  • High heat dissipation stacked chip package structure and the manufacture method thereof
    Patent number: 10014283
    Abstract: The present invention provides a semiconductor device including a first glass substrate, a first integrated chip, a first anisotropic conductive film, a second glass substrate, a second integrated chip, a second anisotropic conductive film, and a packaging body.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: July 3, 2018
    Assignee: Jing Qiao Corporation Limited
    Inventors: Chin-Liang Chiang, Neng-Huang Chu, Yi-Lun Wu