Abstract: A far infrared ray ceramic bulb structure includes a light emitting element under a ceramic substrate, a far infrared thermal radiation film on the ceramic substrate, a circuit unit, a bulb shell, a bulb shade and a connector connected to an external power supply. The circuit unit in the connector is electrically connected to the light emitting element and the connector. The bulb shade encloses the light emitting element and the ceramic substrate. The bulb shell is connected to the connector and encloses the far infrared thermal radiation film. The far infrared thermal radiation film propagates the heat generated by the light emitting element by far infrared thermal radiation. The working temperature of the light emitting element is reduced and the stability and the efficiency of light emitting are improved to increase the lifetime and the safety.

Abstract: A light emitting diode (LED) street lamp includes an LED chip, a ceramic substrate, a lamp shade, a nano-enamel layer and a thermally radiative heat dissipation film. The nano-enamel layer is disposed on the ceramic substrate to provide electrical insulation and isolation for protection, is made from nano-particles to have a surface with the function of self-cleaning due to lotus effect. The thermally radiative heat dissipation film is disposed on the inner surface of the lamp shade and the surface of the ceramic substrate, and has a surface microscopic crystalline structure. The thermally radiative heat dissipation film fastly propagates the heat generated by the LED chip by thermal radiation in some specific direction so as to improve the efficiency of heat dissipation, reduce the total thickness, enhance the efficiency of light emitting and effectively prolong the lifetime of the LED street lamp.

Abstract: A ceramic radiation heat dissipation structure for heat dissipation from a heat source includes a ceramic substrate, a first radiation heat dissipation film and a porous heat dissipation plate. One surface of the ceramic substrate is attached to the heat source and the other surface of the ceramic substrate is provided with a first radiation heat dissipation film. The porous heat dissipation plate is attached to the first radiation heat dissipation film. The porous heat dissipation plate has at least one heat dissipation hole, and an inner sidewall of the at least one heat dissipation hole is provided with a second radiation heat dissipation film. The heat generated by the heat source is fast propagated outwards because of the high efficiency of thermal radiation provided by the first and second radiation heat dissipation films.

Abstract: A light emitting diode (LED) street lamp includes an LED chip, a ceramic substrate, a lamp shade, a nano-enamel layer and a thermally radiative heat dissipation film. The nano-enamel layer is disposed on the ceramic substrate to provide electrical insulation and isolation for protection, is made from nano-particles to have a surface with the function of self-cleaning due to lotus effect. The thermally radiative heat dissipation film is disposed on the inner surface of the lamp shade and the surface of the ceramic substrate, and has a surface microscopic crystalline structure. The thermally radiative heat dissipation film fastly propagates the heat generated by the LED chip by thermal radiation in some specific direction so as to improve the efficiency of heat dissipation, reduce the total thickness, enhance the efficiency of light emitting and effectively prolong the lifetime of the LED street lamp.

Abstract: An LED with a honeycomb radiating heat dissipation device includes a sapphire substrate, an LED epitaxy layer on the sapphire substrate, a thermally conductive binding layer, an intermediate heat dissipation layer, a base substrate and a honeycomb-like heat dissipation device. The thermally conductive binding layer is provided to bind the sapphire substrate and the intermediate heat dissipation layer. The honeycomb-like heat dissipation device is in contact with the base substrate and includes a heat dissipation body and holes, each having a sidewall covered with a thermally radiative heat dissipation film. The intermediate heat dissipation layer and the thermally radiative heat dissipation film is made from a mixture of metal and nonmetal and has a microscopic surface structure with specific crystal, so as to provide high efficiency of heat dissipation by thermal radiation.

Abstract: A far infrared ray ceramic bulb structure includes a light emitting element under a ceramic substrate, a far infrared thermal radiation film on the ceramic substrate, a circuit unit, a bulb shell, a bulb shade and a connector connected to an external power supply. The circuit unit in the connector is electrically connected to the light emitting element and the connector. The bulb shade encloses the light emitting element and the ceramic substrate. The bulb shell is connected to the connector and encloses the far infrared thermal radiation film. The far infrared thermal radiation film propagates the heat generated by the light emitting element by far infrared thermal radiation. The working temperature of the light emitting element is reduced and the stability and the efficiency of light emitting are improved to increase the lifetime and the safety.

Abstract: Disclosed are a radiation heat dissipation LED structure and a manufacturing method thereof. The radiation heat dissipation LED structure includes a sapphire substrate, an LED epitaxy layer, a base substrate, a radiation heat dissipation film, and a thermally conductive binding layer provided between the sapphire substrate and the radiation heat dissipation film to bind the sapphire substrate and the base substrate. The radiation heat dissipation film consists of a mixture of metal and nonmetal. The surface of the film has a microscopic structure with crystal, which has high efficiency of heat dissipation and can fast transfer the heat generated by the LED epitaxy layer outwards through the base substrate by thermal radiation. Therefore, the working temperature of the LED epitaxy layer is greatly reduced so as to improve the efficiency of light emitting and the lifetime.

Abstract: A ceramic printed circuit board (PCB) structure includes a ceramic substrate, silver paste layers and nano-enamel layers. A first silver paste layer of the silver paste layers is provided on the ceramic substrate. The other silver paste layers of the silver paste layers and the nano-enamel layer of the nano-enamel layers are interleaved with each other, and each silver paste layer consists of a circuit pattern for electrically connecting a plurality of electrical elements. Each nano-enamel layer except the last nano-enamel layer of the nano-enamel layers consists of an interlayer electrical connection line for electrically connecting two corresponding circuit patterns on two adjacent nano-enamel layers so as to form the ceramic PCB structure with a multilayer of circuit patterns. The working temperature and the electrical insulation are thus greatly improved.

Abstract: Disclosed are a heat radiation dissipation film structure and a method of making the same. The heat radiation dissipation film structure includes a substrate which is electrically insulated and a heat radiation dissipation film disposed on the substrate. The difference between the thermal expansion coefficients of the substrate and the heat radiation dissipation film is not greater than 0.1%. The heat radiation dissipation film contains the crystal of at least one metal and nonmetal with a specific microscopic surface structure which is formed by spraying and coating the heated mixture onto the substrate under high pressure. The heat radiation from the heat radiation dissipation film is directed from the interface of the heat radiation dissipation film and the substrate towards the substrate.

Abstract: A chip-on-board (COB) LED structure includes a ceramic substrate, a thermally radiative heat dissipation film, a thermally conductive binding layer, an LED chip, a nano-enamel layer, a circuit layer, a plurality of electrical connection lines, a fluorescent glue and a package resin. The LED chip is bound to the thermally radiative heat dissipation film formed on the ceramic substrate by the thermally conductive binding layer, the nano-enamel layer encloses the thermally radiative heat dissipation film for electrical insulation and protection, and the circuit layer has a circuit pattern formed on the nano-enamel layer. The electrical connection lines are configured to electrically connect the LED chip to the circuit layer, the fluorescent glue is coated on the LED chip to provide the effect of fluorescence, and the package resin encloses the circuit layer, the electrical connection lines, the nano-enamel layer and the fluorescent glue.

Abstract: An LED structure includes a sapphire substrate, an epitaxy light emitting structure, a transparent conductive heat dissipation film, a first metal contact layer and a second metal contact layer. The transparent conductive heat dissipation film is electrically conductive and thermally radiative, and has a surface microscopic crystalline structure. The heat generated by the epitaxy light emitting structure is propagated by thermal radiation in a direction from the upper surface to the lower surface of the transparent conductive heat dissipation film. The transparent conductive heat dissipation film successfully replaces the transparent ITO (indium tin oxide) film to provide similar optical and electrical feature and performs fast heat dissipation by directive thermal radiation. The heat dissipation and efficiency of light emitting are greatly improved so as to prolong the lifetime of LED and final LED products.

Abstract: A light emitting diode (LED) includes a sapphire substrate, a first thermoradiation heat-dissipation layer, a second thermoradiation heat-dissipation layer, an epitaxy light emitting structure, a first metal contact layer and a second metal contact layer. The first and second thermoradiation heat-dissipation layers are fabricated from a mixture of metal and nonmetal, and are fabricated on the upper and lower surfaces of the sapphire substrate, respectively. The heat generated by the epitaxy light emitting structure propagates through the first and second thermoradiation heat-dissipation layers by directive thermal radiation. The efficiency of heat dissipation is improved to increase the efficiency of light emitting and prolong the lifespan of LED and LED products.

Abstract: A far infrared ray ceramic flat plate heating module is provided. The far infrared ray ceramic flat plate heating module includes a ceramic heat-generating flat plate, an integrated terminal block for electrical distribution, a metal plate and a metal frame. The ceramic heat-generating flat plate includes a ceramic flat plate, a heat-generating film coated on a surface of the ceramic flat plate, silver paste electrodes configured on and coupled to two opposite sides of the heat-generating film, a first insulating layer coated on the heat-generating film and the silver paste electrodes, a temperature sensor configured by forming a temperature sensing paint layer on the first insulating layer, and a second insulating layer formed on the temperature sensor. The integrated terminal block is secured on the metal plate. The metal frame is disposed surrounding the periphery of the metal plate and the ceramic heat-generating flat plate.