Patents Assigned to JK Molds, Inc.
  • Patent number: 5609893
    Abstract: A temperature and molding material pressure compensated probe for use in injection molding apparatus. The probe includes a two-part telescoping body with a molding material filled space therebetween. Longitudinal thermal expansion which formerly presented sealing problems only results in changes in the extent of telescoping overlap. Molding material pressure is applied equally to both probe parts tending to improve sealing. The molding material filled space has a greater transverse area than all outlets and passages.
    Type: Grant
    Filed: January 12, 1995
    Date of Patent: March 11, 1997
    Assignee: JK Molds, Inc.
    Inventor: Gregg Eastwood