Abstract: Disclosed is a film attachment apparatus for a housing of an electronic apparatus. The film attachment apparatus according to various embodiments, which adheres a film on the surface of a housing plate in an electronic apparatus having an edge portion having a curve, comprises: a jig configured to mount and fix the housing plate; a roller configured to press the film with respect to the housing plate; a vertical driving portion configured to move the roller from the upper portion to the lower portion of the surface of the housing plate, to which the film is adhered, and to press the roller with respect to the film; and a horizontal driving portion configured to move the roller from the surface of the housing plate in the direction toward the edge portion of the housing plate.