Abstract: An applicator assembly is provided for depositing various kinds of viscous, spreadable media onto workpieces, such as circuit boards and metal and ceramic substrates, and includes a blade structure having a metal blade portion and a plastic blade portion joined together along one of their respective longitudinal edges. The blade structure is removably attachable to a blade holder and is reversible so that the metal blade can be secured to the blade holder which is mounted to a screen and stencil printer, thus exposing the plastic blade portion for use in screen and stencil printing operations. Alternatively, the blade structure can be secured to the blade holder thereby exposing the metal blade portion for use in screen and stencil printing operations.

Abstract: An apparatus for spreading and depositing a viscous liquid or paste-like material on a substrate includes a housing removably insertable into a diamond- or square-shaped squeegee blade holder, the blade holder itself mounted to a squeegee head assembly of a screen or stencil printer. The squeegee head assembly is driven in a linear direction over and above the substrate, dragging the blade over the substrate and forcing deposition of the material onto the substrate. The housing includes a pair of oppositely-disposed locking clamps that attach to both ends of the housing. A shaft having a blade secured thereto is disposed through the channels of the clamps and within a groove of the housing, and the shaft is rotatable within the housing and the locking clamps so that the angle of attack between the blade and substrate can be selectively adjusted and, once the appropriate angle of application is selected, the blade is fixed in position by tightening the clamps against the shaft.

Abstract: A presaturated wipe for cleaning the surface of a surface mount technology board, towels or wipes are saturated with a combination of 95 weight % glycol ethers and less than 5 weight % alcohols, the boards are cleaned with the presaturated wipe and do not require a rinse.

Abstract: A solder paste applicator for dispensing a tin/lead solder in a uniform, homogeneous fashion. The solder paste applicator comprises both a mixing assembly and a plunger assembly. The mixing assembly mixes the solder until it is homogeneous and the plunger assembly is used to dispense the solder. The solder paste applicator has a tubular section, a trough section terminating in a scoop, and a collar received at the intersection of the tubular section and the trough section. The mixing assembly is received in the tubular section and is reciprocated to mix the solder.