Abstract: The present invention relates to a sealing apparatus for vacuum window manufacturing equipment, the sealing apparatus being configured to cover a vacuum hole formed in at least one glass plate for a vacuum window with a cover. The sealing apparatus includes: a vacuum chamber including an internal space and configured to be evacuated for forming a vacuum therein; a cartridge installed in the internal space and accommodating a plurality of covers; a cartridge elevator installed on the vacuum chamber and configured to sequentially lift or lower the cartridge; a cover transfer device installed in the internal space and configured to transfer the covers one by one from the cartridge; a cover-rest head configured to receive a cover from the cover transfer device; and a head elevator configured to lift up the cover-rest head to the vacuum hole of the glass plate.

Abstract: Provided are a wafer having a thermal circuit and power supplier therefor, which enable the wafer to heat or cool itself without using any additional heating or cooling system. The wafer includes the thermal circuit that is installed on one side of the wafer to be capable of self-heating or self-cooling the wafer in order to perform a heating process or cooling process on a semiconductor device formed on the surface of the wafer and exchanges heat with the semiconductor device. Thus, a temperature of a semiconductor device can be precisely controlled, and heating and cooling energies are greatly reduced through a direct heat exchange method, thus attaining high efficiency. Since the thermal circuit is directly installed in the wafer, it is structurally simple and the costs of production and installation can be notably reduced. Also, the present invention is very advantageous for optimization, miniaturization, simplification, and environmentally friendly production of a wafer heating/cooling system.

Abstract: Provided are a wafer having a thermal circuit and power supplier therefor, which enable the wafer to heat or cool itself without using any additional heating or cooling system. The wafer includes the thermal circuit that is installed on one side of the wafer to be capable of self-heating or self-cooling the wafer in order to perform a heating process or cooling process on a semiconductor device formed on the surface of the wafer and exchanges heat with the semiconductor device. Thus, a temperature of a semiconductor device can be precisely controlled, and heating and cooling energies are greatly reduced through a direct heat exchange method, thus attaining high efficiency. Since the thermal circuit is directly installed in the wafer, it is structurally simple and the costs of production and installation can be notably reduced. Also, the present invention is very advantageous for optimization, miniaturization, simplification, and environmentally friendly production of a wafer heating/cooling system.