Abstract: Micro-mechanical flappers for use as an electronic display technology and methods related to the fabrication thereof are disclosed. These methods are consistent with standard silicon based semiconductor processing used to make integrated circuits. One embodiment shows how cross-talk or flapper-to-flapper interference is minimized using a Digital Signal Processor (DSP) to compensate for this undesirable effect. Also disclosed is the construction of a micro-mechanical flapper that uses a combination of two springs, viz. a leaf spring and a torsion spring, to reduce maximum bending stress and to lower operating voltage. Also, the spring construction is made such that axial stability is improved over a single leaf spring approach and a light shield is integrated onto the flapper assembly so that the overhead stationary electrode is simply a supporting glass plate with a transparent conducting layer over its surface.

Abstract: A micro-mechanical shutter array using micro-mechanical technology and silicon-on-transparent-substrate technology. The micro-mechanical shutter array is operated by using electro-static forces. Two basic types of shutter movements are described, viz. an electric force/electric counter-force and an electric force/mechanical (spring) counter-force.

Abstract: A monolithic opto-coupler employing silicon-insulator technology in which at least two p-type silicon islands disposed on said insulating layer and a light emitting diode having enhanced light emitting efficiency is formed on one of said islands. The enhanced light emitting diode is either of the type having the surface of said p-type silicon island being electrochemically etched to provide a porous silicon layer, having carbon implanted in damaged silicon, or having an amorphous silicon-carbide layer. A silicon diode detector is formed on the other island(s) and a reflective layer is disposed over the light-emitting diode and the detectors for coupling light generated in the light emitting diode to the silicon diode detector.