Patents Assigned to Jonan Industrial Co., Ltd.
  • Structure of bonding plastic part insert-molded with wiring board and method of bonding the same
    Patent number: 7172469
    Abstract: In insert-molding a wiring board, at either one of a surrounding of a holding hole of the wiring board provided at a first plastic part and a second plastic part opposed thereto, a hole side projected portion capable of being brought into contact with a bonding face of other thereof is provided, and the surrounding of the holding hole in the first plastic part and the second plastic part are bonded to each other by melting the hole side projected portion by applying ultrasonic wave to bonding portions of the two plastic parts.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: February 6, 2007
    Assignees: OHI Seisakusho Co., Ltd., Jonan Industrial Co., Ltd.
    Inventors: Haruo Mochida, Shingo Goto, Masakazu Akahori, Yoshio Itabashi, Katsumi Uraguchi, Tsugio Nakata
  • Structure of bonding plastic part insert-molded with wiring board and method of bonding the same
    Publication number: 20040123947
    Abstract: In insert-molding a wiring board, at either one of a surrounding of a holding hole of the wiring board provided at a first plastic part and a second plastic part opposed thereto, a hole side projected portion capable of being brought into contact with a bonding face of other thereof is provided, and the surrounding of the holding hole in the first plastic part and the second plastic part are bonded to each other by melting the hole side projected portion by applying ultrasonic wave to bonding portions of the two plastic parts.
    Type: Application
    Filed: September 12, 2003
    Publication date: July 1, 2004
    Applicants: OHI SEISAKUSHO CO., LTD., JONAN INDUSTRIAL CO., LTD.
    Inventors: Haruo Mochida, Shingo Goto, Masakazu Akahori, Yoshio Itabashi, Katsumi Uraguchi, Tsugio Nakata