Abstract: The invention relates to a stacking device and a method for stacking flat materials, e.g. electrodes having a separation film (1) interposed in a zigzag manner by means of a guiding device (8). The stacking device comprises a stacking table (11), a holder (4; 5) for immobilizing the stack, and grippers (6, 7) for picking the electrodes (2, 3) up and putting them down in a defined manner, said grippers having an excess pressure module (9) for the targeted shaping of a defined film pocket (17) in the separation film (1).

Abstract: The invention relates to a stacking device and a method for stacking flat materials, e.g. electrodes having a separation film (1) interposed in a zigzag manner by means of a guiding device (8). The stacking device comprises a stacking table (11), a holder (4; 5) for immobilizing the stack, and grippers (6, 7) for picking the electrodes (2, 3) up and putting them down in a defined manner, said grippers having an excess pressure module (9) for the targeted shaping of a defined film pocket (17) in the separation film (1).

Abstract: A gripper for holding two-dimensional components with a low degree of loading, has a clamping ring connected to a controllable robot arm with a baffle plate connected to the clamping ring by a funnel-shaped component and has a gripping face which communicates with a flow system which passes through the funnel-shaped component and the baffle plate. After an excess pressure has been applied to the gripper, a negative pressure is produced on the gripping face in order to attach by suction a wafer to be gripped. A rubberized bearing surface of a bearing ring integrated in the gripping face provides a slip-resistant movement of the wafer. A sensor detects the wafer hat is attached to the gripping face by suction.

Abstract: A method of forming stacks of wafers. One half of the number of the wafers provided serially in the transfer carrier is transferred out of the transfer carrier in the form of a first wafer stack in a mounted standby position located outside of the transfer carrier, then the other half of the number of wafers serially provided in the transfer carrier is moved out of the transfer carrier in the form of a second wafer stack and the second wafer stack is swiveled so that the wafers of the second wafer stack reach a position swiveled by 180° in relation to the position of the wafers of the first wafer stack in its standby position. The second wafer stack is transferred to the standby position of the first wafer stack, aligned to it and then joined together as form fitting with the first wafer stack.

Abstract: Method and device for forming a packet-like back-to-back wafer batch made up of a predetermined even number of wafers that are to be doped on one side. The wafers of one half of the batch are horizontally and congruously arranged on supporting surfaces of a support system which are disposed at a vertical distance from each other. Holding elements of a holding system have a horizontal upper holding surface and a horizontal lower surface and are provided so as to be movable back and forth relative to two adjacent supporting surfaces between a releasing position and a holding position. The wafers of the second half of the batch, which have previously been moved into a position that is offset by 180° relative to the position of the wafers of the first half are inserted into a holding system so each wafer of the second half rests on the horizontal upper holding surface.

Abstract: A method for positioning or guiding at least one arbitrary print head or a printing unit having at least one pressure nozzle for the imprinting of thin substrates such as wafers at a defined distance above the surface of the substrate, which is to be provided on a support like a paddle or printing table. Distance sensors continuously acquired distance measurements to the surface of the substrate which is to be imprinted. An adjustment of the print head up to 6 degrees of freedom is ensured by actuators in such a manner that the section of the opening of the pressure nozzle of the print head can be adjusted so as to be coplanar to the section of the surface of the substrate which is to be imprinted. The print head is thus maintained or readjusted so as to adjust the section of the opening of the pressure nozzle of the print head to the surface of the substrate which is to be positioned on the support table so as to be coplanar and so as to maintain the coplanar position during the printing process.

Abstract: The invention relates to a mounting device for solar wafers (2), comprising at least one comb-like holder (1) having an elongated web (3), on which along the longitudinal extension thereof a plurality of comb elements (4) arranged at equal distances from each other are provided, wherein between the surfaces of neighboring comb elements (4) facing each other at least one recess (5 or 6) is formed, which comprises a contact surface (7) and a guiding surface (8) for the solar wafer (2) to be inserted into the recess (5 or 6).