Abstract: A low power electrical circuitry component is made from several laminae stacked one on top of the next; at least two of the laminae are provided with circuitry, suitably printed circuitry with electrical connections between circuit elements of the circuitry on one lamina interconnected with those elements of the next or subsequent such laminae by means of connections substantially perpendicular to the planes of the laminae; apertures or recesses may be formed in some of the laminae to provide holders for wafers and other circuitry items so that the laminae provide a strong frame and encapsulation for wafers and so on; ducts may be provided in or between laminae for cooling.