Patents Assigned to JP Nippon Mining & Metals Corporation
  • Sn-plated copper alloy strip having improved fatigue characteristics
    Patent number: 8182932
    Abstract: The object of the invention is to provide a reflow Sn-plated copper alloy strip having improved fatigue characteristics by preventing the degradation of fatigue characteristics caused by reflow Sn plating. The invention provides a copper alloy strip having an Sn or Sn alloy plating film formed thereon by electroplating and reflowing treatment, wherein average hydrogen concentration in the strip being about 2 mass ppm or less.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: May 22, 2012
    Assignee: JP Nippon Mining & Metals Corporation
    Inventor: Takaaki Hatano