Abstract: The present discloses provides a method to cut and chamfer glass or glass-like workpieces such as glass, quartz, glass-ceramic or sapphire in one operation or process. The workpiece is cut and chamfered to arbitrary shapes by the same process without the need to separate cutting process and chamfering process. In the present disclosure, the workpiece material is selectively removed through a fast chemical reaction induced by locally heating using a laser beam.