Abstract: A power semiconductor device comprising a first metal electrode and a second metal electrode formed on a first substrate surface of a semiconductor substrate, a semi-insulating field plate interconnecting said first and second metal electrodes, and an insulating oxide layer extending between said first and second metal electrodes and between said field plate and said semiconductor substrate, wherein said semi-insulating field plate is a titanium nitride (TiN) field plate.
Type:
Grant
Filed:
December 10, 2014
Date of Patent:
May 9, 2017
Assignee:
JSAB TECHNOLOGIES LIMITED
Inventors:
Johnny Kin-On Sin, Iftikhar Ahmed, Chun-Wai Ng