Patents Assigned to JSP Corporation
  • Patent number: 7964652
    Abstract: Disclosed is a method for production of an expandable polyethylene resin particle having a foaming agent impregnated therein, which comprises polymerizing a styrene monomer or a monomer mixture containing a styrene monomer onto a nuclear particle comprising an ethylene-vinyl acetate copolymer and a linear low-density polyethylene.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: June 21, 2011
    Assignee: JSP Corporation
    Inventors: Kazuki Okamura, Hiroshi Nakaguki
  • Patent number: 7960443
    Abstract: The present invention relates to an extruded styrenic resin foam and a method for producing the same, wherein a base resin composing the extruded styrenic resin foam is a styrenic resin mixture of a styrene-(meth)acrylic ester copolymer, or a combination of a styrene-(meth)acrylic ester copolymer and polymethyl methacrylate, and a styrenic resin except the styrene-(meth)acrylic ester copolymer, and the styrenic resin mixture contains a (meth)acrylic ester component at a ratio of 4 to 45% by weight with reference to the styrenic resin mixture. The present invention provides an extruded styrenic resin foam having an apparent density of 20 to 60 kg/m3, a thickness of 10 to 150 mm, and a low thermal conductivity, and keeping excellent heat insulation performance over a long period of time and flame retardancy, even when the styrenic resin extruded foam is foamed using a blowing agent having an ozone depleting potential of 0 (zero) and a low global warming potential.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: June 14, 2011
    Assignee: JSP Corporation
    Inventors: Shunsuke Sekiya, Atsushi Taira, Noritoshi Nishiyama, Naochika Kogure
  • Patent number: 7901764
    Abstract: An object of the present invention is to provide a multi-layered polylactic acid resin foamed body of a crystalline polylactic acid resin which has good appearance and excellent mechanical strength such as bending strength and compressive strength and which is capable of being imparted with excellent heat resistance, and to provide a multi-layered polylactic acid resin foamed molded article having excellent appearance, heat resistance and mechanical strengh. The multi-layered polylactic acid resien foamed body of the present invention is a laminate having a polylactic acid resin foamed layer and a thermoplastic resin layer provided at least one side of the foamed layer, wherein the foamed layer has a cell shape satisfying specific conditions, wherein the difference (?Hendo:2° C./min??Hexo:2° C./min) between an endothermic calorific value (?Hendo:2° C./min) and an exothermic calorific value (?Hexo:2° C.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: March 8, 2011
    Assignee: JSP Corporation
    Inventors: Kenichi Takase, Takashi Kawada, Akira Iwamoto
  • Patent number: 7863343
    Abstract: Expandable polylactic acid resin particles including (a) a base resin containing a polylactic acid resin having at least 50 mol % of lactic acid monomer component units, (b) a polyolefin wax in an amount of 0.0001 to 1 part by weight per 100 parts by weight of the base resin, and (c) a blowing agent in an amount of 1 to 30% by weight based on the weight of the resin particles. The expandable resin particles can give expanded beads having an average cell diameter of 10 to 500 ?m. The expanded beads can give in-mold foam moldings.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: January 4, 2011
    Assignee: JSP Corporation
    Inventors: Kenji Haraguchi, Hajime Ohta
  • Patent number: 7803849
    Abstract: The present invention is to solve conventional problems, namely, that when an attempt is made to obtain a thick, in-mold foamed molded article with excellent fusibility between beads formed from an acrylic resin expanded beads, cooling takes an extremely long time and production efficiency is poor, and to provide acrylic resin expanded beads with which an in-mold foamed molded article with excellent fusibility between expanded beads can be manufactured in a short cooling time even with a thick foamed molded article such as a block foamed molded article, and the molding cycle can be improved. The acrylic resin expanded beads of the present invention are expanded beads in which an acrylic resin serves as a base resin, and the bead surfaces have continuous ridges in a mesh pattern.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: September 28, 2010
    Assignee: JSP Corporation
    Inventor: Kenji Haraguchi
  • Patent number: 7727606
    Abstract: A polylactic acid resin foamed molding obtained by placing in a mold a cylindrical body having a foamed layer, which is formed by extruding a foamable molten resin composition prepared by kneading together a polylactic acid resin and a physical blowing agent from a die into a low-pressure zone, and molding it, wherein the molding's foamed layer constituting the foamed molding has a difference (?Hendo:2° C./min??Hexo:2° C./min) between the endothermic calorific value (?Hendo:2° C./min) and the exothermic calorific value (?Hexo:2° C./min) obtained by heat flux differential scanning calorimetry (heating rate of 2° C./min) of 10 J/g or more and a melt tension at 190° C. of 2 cN or more.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: June 1, 2010
    Assignee: JSP Corporation
    Inventors: Kenichi Takase, Masayasu Okuda, Masato Naito
  • Publication number: 20100086758
    Abstract: A foamed sheet of a base resin containing 50 to 100% by weight of a polylactic acid resin and having an apparent density of 63 to 630 kg/m3, a thickness of 0.5 to 7 mm and endothermic and exothermic calorific values of ?Hendo:2 and ?Hexo:2, respectively, as measured by heat flux differential scanning calorimetry at a heating rate of 2° C./min. The endothermic calorific value ?Hendo:2 is at least 10 J/g and the difference (?Hendo:2-?Hexo:2) between the endothermic calorific value ?Hendo:2 and the exothermic calorific value ?Hexo:2 is more than 20 J/g and less than 40 J/g. A foam molding such as a receptacle is prepared by thermoforming the foamed sheet.
    Type: Application
    Filed: November 20, 2009
    Publication date: April 8, 2010
    Applicant: JSP Corporation
    Inventors: Kenichi Takase, Takashi Kawada, Akira Iwamoto
  • Patent number: 7678839
    Abstract: Expanded beads including cell walls which define a plurality of cells and which comprise a base resin containing a polypropylene resin, each of the beads having a through hole extending therein from one end to the other end. The expanded beads have a maximum diameter D0 (mm), an average cell diameter LCV in a radial direction, an average cell diameter LCH in a circumferential direction and a maximum through hole diameter HD (mm) satisfying the following conditions: LCV/LCH is at least 1.05, HD/D0 is 0.08 to 0.4 and the ratio HD/LCV is 0.1 to 10, where D0, LCV and LCH are as defined in the specification. The expanded beads may give a foam molding by an in-mold molding method.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: March 16, 2010
    Assignee: JSP Corporation
    Inventor: Hidehiro Sasaki
  • Patent number: 7645810
    Abstract: A foamed sheet of a base resin containing 50 to 100% by weight of a polylactic acid resin and having an apparent density of 63 to 630 kg/m3, a thickness of 0.5 to 7 mm and endothermic and exothermic calorific values of ?Hendo:2 and ?Hexo:2, respectively, as measured by heat flux differential scanning calorimetry at a heating rate of 2° C./min. The endothermic calorific value ?Hendo:2 is at least 10 J/g and the difference (?Hendo:2??Hexo:2) between the endothermic calorific value ?Hendo:2 and the exothermic calorific value ?Hexo:2 is less than 40 J/g. A foam molding such as a receptacle is prepared by thermoforming the foamed sheet.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: January 12, 2010
    Assignee: JSP Corporation
    Inventors: Kenichi Takase, Takashi Kawada, Akira Iwamoto
  • Patent number: 7581769
    Abstract: The present invention discloses a bumper absorber that is provided on an automobile between a bumper reinforcement and a bumper fascia, comprising a first energy absorbing portion formed by foaming a resin molded material; the first energy absorbing portion extending from the bumper reinforcement toward the bumper fascia; a second energy absorbing portion formed by a resin molded material; the second energy absorbing portion extending from the bumper reinforcement toward the bumper fascia at a position where a space that permits buckling is formed between the first energy absorbing portion and the second energy absorbing portion on the bumper reinforcement side; a crosslinking portion disposed facing a vehicle interior side of the bumper fascia; and the crosslinking portion fastening the first energy absorbing portion and the second energy absorbing portion together while sealing an opening between the first energy absorbing portion and the second energy absorbing portion on the bumper fascia side.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: September 1, 2009
    Assignees: Hayashi Telempu Co., Ltd., JSP Corporation
    Inventors: Kohsuke Wakabayashi, Takahiko Taniguchi, Satoru Shioya, Masakazu Sakaguchi
  • Patent number: 7560498
    Abstract: A process of producing a foamed molding, wherein expanded, substantially non-crosslinked polypropylene-based resin beads are heated in a mold to fuse-bond the beads together into a unitary body. Each of the expanded beads has been surface-modified with an organic peroxide.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: July 14, 2009
    Assignee: JSP Corporation
    Inventors: Hidehiro Sasaki, Akinobu Hira, Keiichi Hashimoto, Hisao Tokoro
  • Patent number: 7531116
    Abstract: A process of producing a foamed molding, wherein expanded, substantially non-crosslinked polypropylene-based resin beads are heated in a mold to fuse-bond the beads together into a unitary body. Each of the expanded beads has been surface-modified with an organic peroxide.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: May 12, 2009
    Assignee: JSP Corporation
    Inventors: Hidehiro Sasaki, Akinobu Hira, Keiichi Hashimoto, Hisao Tokoro, Mitsuru Shinohara, Tomoo Tokiwa
  • Patent number: 7390445
    Abstract: A method of producing a composite sheet having a foam layer of a first polyolefin-based resin and a surface layer of a second polyolefin-based resin provided on at least one side of the foam layer and containing a polymeric antistatic agent. The method includes coextruding through die a first melt containing the first polyolefin-based resin and a physical blowing agent and a second melt containing the second polyolefin-based resin, the polymeric antistatic agent and a volatile plasticizer to obtain the composite sheet. The amount of the polymeric antistatic agent is 4 to 100 parts by weight per 100 parts by weight of the second polyolefin-based resin and the amount of the volatile plasticizer is 5 to 50 parts by weight per 100 parts by weight of a total amount of the second polyolefin-based resin and the polymeric antistatic agent. The second polyolefin-based resin has a crystallization temperature of Ta [° C.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: June 24, 2008
    Assignee: JSP Corporation
    Inventors: Kazuhiko Morita, Satoshi Iwasaki, Shinpei Arita
  • Publication number: 20080125502
    Abstract: Expanded beads of a polypropylene resin composition having a bulk density of 10 g/L to 450 g/L, wherein the composition contains (A) a polypropylene resin as a major ingredient, (B) an organic acid-modified olefin elastomer, and (C) a fatty acid amide. A foamed molded article having an apparent density of 10 g/L to 450 g/L obtained by heating the above expanded beads in a mold cavity.
    Type: Application
    Filed: November 27, 2006
    Publication date: May 29, 2008
    Applicant: JSP Corporation
    Inventors: Thierry Arnold Reichman, Boris Stephan Wozniak
  • Patent number: 7323128
    Abstract: An in-mold foam molding equipment, includes at least a movable partition member for dividing a molding space formed by a pair of molds into divided spaces, wherein the partition member is composed of a plurality of divisional partition members, wherein each of the divisional partition members individually has a retreat positioning protrusion and a insert positioning protrusion, and the divisional partition members are installed in a slider, wherein the slider is configured to move between the retreat positioning protrusions and the insert positioning protrusions, and the divisional partition members are configured to be movable in cooperation with the motion of the slider moving by contacting with the retreat positioning protrusions or the insert positioning protrusions, so that the divisional partition members divide the molding space into divided spaces, and therefore an integral molded article suppressed in occurrence of large protrusions and deep holes can be manufactured.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: January 29, 2008
    Assignee: JSP Corporation
    Inventors: Seishiro Murata, Satoru Shioya, Masayuki Fukuda
  • Patent number: 7300960
    Abstract: A specific relationship must be met in case of: (a) a structural unit derived from propylene is present in 100 to 85 mole %, and a structural unit derived from ethylene and/or alpha-olefin with 4 to 20 carbons is present in 0 to 15 mole %; (b) a content of a position irregularity unit based on 2, 1-insertion of a propylene monomer unit in all propylene insertions, which is measured by 13C-NMR, is 0.5% to 2.0% and a content of a position irregularity unit based on 1,3-insertion of propylene monomer unit in all propylene insertions, which is measured by 13C-NMR, is 0.005% to 0.4%; and (c) a water vapor transmission rate is Y [g/m2/24 hr] as film and a melting point Tm[° C.] shows specific relationship.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: November 27, 2007
    Assignee: JSP Corporation
    Inventor: Toru Wada
  • Patent number: 7259189
    Abstract: A process for the production of expanded beads, including kneading a base resin containing a polypropylene resin and having a tensile modulus of at least 1,200 MPa together with a mixture of a coloring agent and a thermoplastic polymer having a tensile modulus lower than that of the base resin to form a kneaded mixture including a matrix of the base resin and a multiplicity of domains dispersed in the matrix and each containing the thermoplastic polymer and the coloring agent. The kneaded mixture is formed into resin particles, then treated with an organic peroxide to modify surfaces of the resin particles therewith. Foaming and expanding of the surface-modified resin particles gives expanded beads having an inside region surrounded by a surface region. The heat of fusion of a high temperature peak of the surface region is lower than that of the inside region.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: August 21, 2007
    Assignee: JSP Corporation
    Inventors: Keiichi Hashimoto, Akinobu Hira, Hidehiro Sasaki
  • Patent number: 7244380
    Abstract: A process for an extruded resin foam, comprising extruding a foamable composition comprising a melted polystyrene resin and a physical blowing agent through a die to obtain a polystyrene resin foam having a thickness of at least 10 mm and a transverse cross-sectional area of at least 50 cm2, wherein said extrusion is performed so that the ratio Mz/Mn of a Z average molecular weight Mz of the polystyrene resin foam to a number average molecular weight Mn of the polystyrene resin foam, each measured by gel permeation chromatography, is 8.0 or more.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: July 17, 2007
    Assignee: JSP Corporation
    Inventors: Naochika Kogure, Teruyuki Akiyama, Noritoshi Nishiyama
  • Publication number: 20070141286
    Abstract: A foamed sheet of a base resin containing 50 to 100% by weight of a polylactic acid resin and having an apparent density of 63 to 630 kg/m3, a thickness of 0.5 to 7 mm and endothermic and exothermic calorific values of ?Hendo:2 and ?Hexo:2, respectively, as measured by heat flux differential scanning calorimetry at a heating rate of 2° C./min. The endothermic calorific value ?Hendo:2 is at least 10 J/g and the difference (?Hendo:2??Hexo:2) between the endothermic calorific value ?Hendo:2 and the exothermic calorific value ?Hexo:2 is less than 40 J/g. A foam molding such as a receptacle is prepared by thermoforming the foamed sheet.
    Type: Application
    Filed: December 19, 2005
    Publication date: June 21, 2007
    Applicant: JSP Corporation
    Inventors: Kenichi Takase, Takashi Kawada, Akira Iwamoto
  • Patent number: 7192265
    Abstract: An in-mold foam molding equipment, includes at least a movable partition member for dividing a molding space formed by a pair of molds into divided spaces, wherein the partition member is composed of a plurality of divisional partition members, wherein each of the divisional partition members individually has a retreat positioning protrusion and a insert positioning protrusion, and the divisional partition members are installed in a slider, wherein the slider is configured to move between the retreat positioning protrusions and the insert positioning protrusions, and the divisional partition members are configured to be movable in cooperation with the motion of the slider moving by contacting with the retreat positioning protrusions or the insert positioning protrusions, so that the divisional partition members divide the molding space into divided spaces, and therefore an integral molded article suppressed in occurrence of large protrusions and deep holes can be manufactured.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: March 20, 2007
    Assignee: JSP Corporation
    Inventors: Seishiro Murata, Satoru Shioya, Masayuki Fukuda