Patents Assigned to JSR Corp.
  • Publication number: 20050145163
    Abstract: There are provided a silicon-film-forming composition containing silicon particles and a dispersion medium and a method for forming a silicon film by forming a coating film of the silicon-film-forming composition on a substrate and subjecting the coating film to instantaneous fusion, a heat treatment or a light treatment. According to the composition and the method, a polysilicon film with a desired thickness which may be used as a silicon film for a solar battery can be formed efficiently and easily.
    Type: Application
    Filed: August 15, 2003
    Publication date: July 7, 2005
    Applicant: JSR Corp.
    Inventors: Yasuo Matsuki, Haruo Iwasawa, Hitoshi Kato
  • Publication number: 20050038186
    Abstract: A thermoplastic elastomer composition of the invention, formed by dynamically crosslinking a polymer composition including a rubber and an olefinic resin and having an average particle size of rubber particles within a specific range, shows an excellent balance of mechanical properties such as flexibility and elastic recovery, and a moldability. Also an inclusion of a (meth)acrylate resin and a hydrogenated diene polymer provides a composition particularly excellent in scratch resistance. Also an inclusion of a maleimide compound provides a composition particularly excellent in injection fusibility. Also an inclusion of an undenatured organopolysiloxane of a specific viscosity and a denatured organopolysiloxane provides a composition particularly excellent in initial slidability and durable slidability.
    Type: Application
    Filed: June 27, 2002
    Publication date: February 17, 2005
    Applicant: jsr corp.
    Inventors: Akihiko Morikawa, Kentaru Kanae, Hideo Nakanishi, Minoru Maeda, Takahiro Okamoto
  • Patent number: 5874041
    Abstract: A photo-curable resin composition suitable as a material for optical molding. The composition can produce cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The composition contains a monomer component which contains (A) 20-80 wt % of a urethane-bond polyfunctional (meth)acrylate having a number average molecular weight of 1,000 or less and (B) 80-20 wt % of an ethylenically unsaturated monomer containing a cyclic structure and at least one ethylenically unsaturated bond in the molecule and of which the homopolymer has a glass transition temperature of 50.degree. C. or higher; (C) a photopolymerization initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: February 23, 1999
    Assignees: DSM N.V., JSR Corp., Japan Fine Coatings Co., Ltd.
    Inventors: Ayao Matsumura, Yuichi Haruta, Tsuyoshi Watanabe, Takashi Ukachi