Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.
Type:
Grant
Filed:
April 24, 2014
Date of Patent:
May 24, 2016
Assignee:
JST MANUFACTURING, INC.
Inventors:
Jacob Stafford, David Campion, Travis Deleve, Jason Boyd
Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.
Type:
Application
Filed:
April 24, 2014
Publication date:
October 30, 2014
Applicant:
JST Manufacturing Inc.
Inventors:
Jacob Stafford, David Campion, Travis Deleve, Jason Boyd