Abstract: A laser processing apparatus includes: a stage 2 capable of levitating and transporting a substrate 3 by jetting gas from a front surface; a laser oscillator configured to irradiate a laser beam 20a onto the substrate 3; and a gas jetting port arranged at a position overlapping a focus point position of the laser beam 20a in plan view, and being configured to jet inert gas. The front surface of the stage 2 is constituted by upper structures 5a and 5b, and the upper structures 5a and 5b are arranged so as to be spaced apart from each other and face each other. A gap between the upper structures 5a and 5b overlaps the focus point position of the laser beam 20a in plan view. A filling member 8 is arranged between the upper structures 5a and 5b so as to fill the gap between the upper structures 5a and 5b.

Abstract: A conveyance apparatus configured to convey a substrate (100) in order to irradiate the substrate (100) with laser light for forming a line-shaped irradiation area (15a) according to an embodiment includes a levitation unit (10) configured to levitate the substrate (100) over its top surface, a holding mechanism (12) configured to hold the substrate (100), and a moving mechanism (13) configured to move the holding mechanism (12) in a direction inclined from a direction perpendicular to a longitudinal direction of the line-shaped laser light in a plan view so as to change an irradiation place of the laser light in the substrate (100).

Abstract: A laser annealing apparatus according to an embodiment includes a laser light source, an annealing optical system, a linear irradiation region along a Y-direction, a moving mechanism configured to change a relative position of the irradiation region with respect to the substrate along an X-direction, an illumination light source configured to generate illumination light for illuminating the substrate along a third direction, and a detector configured to detect detection light reflected, in a fourth direction, on the substrate illuminated by the illumination light so as to photograph an annealed part of the substrate in a linear field of view along the Y-direction. In a YZ-plane view, the third direction is inclined from the vertical direction and the fourth direction is inclined from the vertical direction.

Abstract: An annealed workpiece manufacturing method of irradiating a workpiece with laser light and annealing the workpiece includes a support step of supporting the workpiece, and an irradiation step of irradiating the supported workpiece with the laser light. In the support step, at least in a laser light irradiation area for the workpiece, the workpiece is supported by a cam member whose upper end height position is adjusted according to a rotation position.

Abstract: A laser annealing apparatus according to an embodiment includes a laser light source, an annealing optical system, a linear irradiation region along a Y-direction, a moving mechanism configured to change a relative position of the irradiation region with respect to the substrate along an X-direction, an illumination light source configured to generate illumination light for illuminating the substrate along a third direction, and a detector configured to detect detection light reflected, in a fourth direction, on the substrate illuminated by the illumination light so as to photograph an annealed part of the substrate in a linear field of view along the Y-direction. In a YZ-plane view, the third direction is inclined from the vertical direction and the fourth direction is inclined from the vertical direction.

Abstract: A laser irradiation apparatus according to an embodiment includes an optical module which irradiates an object with laser light so as to form a linear irradiation region along a first direction and a beam damper which absorbs reflected light having been reflected by the object. The beam damper includes a member and a member fixed to the member. The member includes an eaves portion having an opening portion through which the reflected light passes. The eaves portion has a reflection surface which reflects, toward an internal space enclosed by the member and the member, reflected light having been reflected by the object.

Abstract: Quality of a crystalline film is improved. In a method for manufacturing a panel, a polysilicon film is formed by emission of laser light to an amorphous silicon film 3A through a light-transmittable member 4 that can transmit the laser light.

Abstract: A laser processing apparatus and a laser processing method that can effectively prevent a processing time for one semiconductor film from increasing are provided. A laser processing apparatus (1) according to an embodiment includes a laser light source (2) configured to irradiate a semiconductor film (M1) with a laser beam, a film state measuring instrument (5) configured to measure a state of the semiconductor film after the semiconductor film (M1) is irradiated with the laser beam, and a laser light adjusting mechanism configured to adjust a timing at which the semiconductor film (M1) is irradiated with a next laser beam and intensity of the laser beam according to the state of the semiconductor film (M1) measured by the film state measuring instrument (5).

Abstract: A laser processing apparatus includes: a scan moving unit which moves one or both of a workpiece and a laser beam; a laser beam irradiation unit which irradiates the workpiece with the laser beam; and a gas discharge unit which discharges at least a first gas to an irradiation area irradiated with the laser beam in the workpiece. The gas discharge unit has a rectifying surface at a position facing the workpiece during laser beam irradiation. The rectifying surface is provided with a first gas discharge port through which the first gas is discharged; and one or both of a second gas discharge port and a gas front-back suction port. The second gas discharge port discharges a second gas to the workpiece during laser beam irradiation on both outer sides of the first gas discharge port at least in the scanning direction.

Abstract: A substrate-floatation-type laser processing apparatus and a method for measuring a floating height, capable of improving performance of laser processing are provided. A substrate-floatation-type laser processing apparatus according to an embodiment includes a stage configured to float and convey a substrate, and a floating-height measurement apparatus configured to measure a floating height H of the substrate. Note that a distance between the floating-height measurement apparatus and the substrate can be automatically adjusted according to the measured floating height H. The floating height H of the substrate is measured by applying laser light to the substrate and the stage. The distance between the floating-height measurement apparatus and the substrate is adjusted by using a feedback mechanism in which the measured floating height of the substrate is used as an input.

Abstract: To realize a laser irradiation apparatus by using which accuracy in processing a substrate can be improved. A laser irradiation apparatus according to an embodiment includes a laser irradiation unit configured to apply laser light to a substrate, a base part, and a conveyance stage configured to convey the substrate. The conveyance stage includes a stage configured to be movable over the base part, a base flange fixed over the stage, a substrate stage fixed to an upper end part of the base flange and configured so that the substrate is placed thereover, and a pusher pin for supporting the substrate, the pusher pin being configured to penetrate the substrate stage and to be movable up and down.

Abstract: In a laser irradiation apparatus 1 according to one embodiment, each of first and second flotation units 30a, 30b includes a base 31, and a porous plate 32 bonded to an upper surface of the base 31 by an adhesive layer 34, the base 31 includes a rising portion 312 protruding upward at an outer periphery facing at least the gap, and the porous plate 32 includes a cutout portion 321 configured to fit to the rising portion 312, and the adhesive layer 34 is formed along an inner wall of the rising portion 312 having fitted to the cutout portion 321.

Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).

Abstract: A laser irradiation apparatus includes a laser generation device, a levitation unit to levitate an object to which the laser light is applied, and a conveyance unit to convey the levitated object. The conveyance unit includes a holding mechanism for holding the object by absorption, and a moving mechanism for moving the holding mechanism in a conveyance direction. The holding mechanism includes a base including a plurality of through holes, a plurality of pipes respectively connected to the through holes, a vacuum generation device configured to evacuate air from the pipes, and a plurality of absorption assistance valves each disposed in the middle of a respective one of the pipes, each of the plurality of absorption assistance valves being configured to be closed when a flow rate of a gas flowing into the pipe through the through hole becomes equal to or higher than a threshold.

Abstract: A laser irradiation apparatus includes: a laser generation apparatus configured to generate first laser light for performing heat treatment of an object to be processed; a measurement-laser emission unit configured to emit linearly-polarized second laser light toward an irradiation area on the object to be processed to which the first laser light is applied; a first polarizing plate configured to let, of the whole reflected light of the second laser light reflected by the object to be processed, a part of the reflected light that has a first polarization direction pass therethrough; and a measurement-laser detection unit configured to detect the reflected light that has passed through the first polarizing plate.

Abstract: A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.

Abstract: According to one embodiment, a laser lift-off apparatus (1) which irradiates with laser light (16) from a side of a substrate (11) an interface between the substrate (11) and a separating layer (12) of a workpiece (10) including the substrate (11) and the separating layer (12) formed over the substrate (11), and separates the separating layer (12) from the substrate (11) includes: an injection unit (22) which blows a gas (35) onto the workpiece (10) and blows away dusts existing on a surface of the workpiece (10), and a dust collecting unit (23) which includes an opening (52) at a position meeting an irradiation position of the laser light (16), and sucks and collects the blown dusts through the opening (52).

Abstract: A laser irradiation apparatus (1) according to one embodiment irradiates a workpiece (16) with a laser beam (15) while conveying the workpiece (16) caused to float with the use of a flotation unit (10). The flotation unit (10) includes precision float regions (11a, 11b) and rough float regions (13a to 13j). The precision float regions (11a, 11b) are configured to cause the workpiece (16) to float by utilizing ejection and suction of a gas, and the rough float regions are configured to cause the workpiece (16) to float by utilizing ejection of a gas without suction of a gas.

Abstract: A flotation conveyance apparatus according to an embodiment is for conveying a substrate while floating the substrate by ejecting a gas to a lower surface of the substrate. The flotation conveyance apparatus includes a plurality of ejecting ports configured to eject the gas to the substrate, a downstream flow-path configured to supply the gas to the plurality of ejecting ports, a upstream flow-path configured to supply the gas to the downstream flow-path, and a gas supply port configured to supply the gas to the downstream flow-path. A cross-sectional area of the upstream flow-path is configured to be larger than a cross-sectional area of the downstream flow-path.

Abstract: A laser treatment device performing treatment by irradiating a target object having a plate surface with laser light, including: a light-transmitting region transmitting laser light emitted onto the target object; a rectifier that has a rectifier surface separated from the target object and extending along the plate surface of the target object and outward from the end of the light-transmitting region; a gas supply unit that feeds a gas to a gap between one side of the rectifier surface and the light-transmitting region, in a position separated from the light-transmitting region; and a gas exhaust unit that exhausts, on the other side that is on the other side of the light-transmitting region from the one side, the gas present in a gap between the rectifier surface and the target object from the gap, in a position separated from the light-transmitting region, thereby generating a stable local gas atmosphere.