Patents Assigned to JT Corp.
  • Dual-interface IC card by laminating a plurality of foils and method of same
    Patent number: 7253024
    Abstract: The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: August 7, 2007
    Assignee: JT Corp.
    Inventors: Hong Jun Yu, Jung Ho Kim
  • Method for manufacturing ic card by laminating a plurality of foils
    Publication number: 20050224941
    Abstract: The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.
    Type: Application
    Filed: February 13, 2003
    Publication date: October 13, 2005
    Applicant: JT CORP
    Inventors: Hong Yu, Jung Kim