Patents Assigned to Jumatech GmbH
  • Patent number: 10736214
    Abstract: A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: August 4, 2020
    Assignee: JUMATECH GMBH
    Inventor: Markus Wölfel
  • Patent number: 10627429
    Abstract: The invention relates to a printed circuit board (1) with at least two connection points (3) and at least one precision resistor (2) for measuring a current flowing between the connection points. The aim of the invention is to inexpensively produce a printed circuit board of the type mentioned in the introduction such that the printed circuit board has a reduced installation space while simultaneously having a preferably long service life. According to the invention, this is achieved in that the precision resistor extends between the connection points in the printed circuit board (11). The invention additionally relates to a corresponding method for producing said printed circuit board.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: April 21, 2020
    Assignee: JUMATECH GMBH
    Inventor: Markus Wölfel
  • Patent number: 9474149
    Abstract: The invention relates to an angle-adjustable and/or printed circuit board structure having at least two printed circuit board sections arrangeable or arranged angularly with respect to one another, wherein the printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads, wherein the two contact pads are situated on different printed circuit board sections, wherein the printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: October 18, 2016
    Assignee: JUMATECH GMBH
    Inventor: Markus Wölfel
  • Publication number: 20160282389
    Abstract: The invention relates to a printed circuit board (1) with at least two connection points (3) and at least one precision resistor (2) for measuring a current flowing between the connection points. The aim of the invention is to inexpensively produce a printed circuit board of the type mentioned in the introduction such that the printed circuit board has a reduced installation space while simultaneously having a preferably long service life. According to the invention, this is achieved in that the precision resistor extends between the connection points in the printed circuit board (11). The invention additionally relates to a corresponding method for producing said printed circuit board.
    Type: Application
    Filed: November 13, 2014
    Publication date: September 29, 2016
    Applicant: JUMATECH GMBH
    Inventor: Markus WÖLFEL
  • Publication number: 20150327355
    Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.
    Type: Application
    Filed: November 15, 2013
    Publication date: November 12, 2015
    Applicant: JUMATECH GMBH
    Inventor: Markus WÖLFEL
  • Publication number: 20150237738
    Abstract: A method for producing a circuit board element, and a corresponding circuit board element, with which it is possible to suppress the risk of delamination in the region of a component (e.g. a wire or a plate-like shaped part) that is embedded in the circuit board element. To this end, the present invention suggests that the surface of the component should be roughened, at least partially, in order to ensure a better adhesive bond with the surrounding cover layer (e.g. a prepreg made of an insulating material compound). The component surface can be roughened by chemical methods such as etching or by purely mechanical methods such as sand blasting.
    Type: Application
    Filed: August 30, 2013
    Publication date: August 20, 2015
    Applicant: JUMATECH GMBH
    Inventor: Markus Wölfel
  • Patent number: 8481897
    Abstract: A printed circuit board or card (1) has an electric circuit (1a) and at least one electrically insulated conductive heating wire (2), the heating wire (2) being wire-printed on or in the printed circuit board or card. Heating wire (2) can be connected at connection points (4) to a voltage source (not shown) to be provided on or in the printed circuit board or card (1).
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: July 9, 2013
    Assignee: Jumatech, GmbH
    Inventor: Markus Wöelfel
  • Patent number: 8354594
    Abstract: The invention relates to a wire-printed circuit board or card (1) comprising etched strip conductors (2) and wire conductors (6), which wire conductors run on and/or in the circuit board or card (1) between connection points (4). At least one of the wire conductors (6) has an essentially rectangular, for example, a square, cross-section.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: January 15, 2013
    Assignee: Jumatech, GmbH
    Inventor: Markus Wolfel
  • Patent number: 8076612
    Abstract: A method provides for welding a conductor to a conductive film which is suited for connection to a circuit board support in order to produce a printed circuit board. The depth or diameter of the conductor is preferably greater than the thickness of the conductive film. At least during the welding process, the conductive film is maintained in contact with a thermal isolation plate having a thermal conductivity less than that of the conductive film. After being placed on the circuit board support, the conductive film is partly etched away to electrically isolate electrical contact points.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: December 13, 2011
    Assignee: Jumatech GmbH
    Inventor: Markus Wölfel