Abstract: This disclosure is directed to a three-dimensional vapor chamber device having a thermal base, a vertical thermal plate arranged up-right on the thermal base, and a working fluid accommodated in the thermal base and may flow to the vertical thermal plate. A first chamber having a first capillary structure is defined in the thermal base. A second chamber having a second capillary structure is defined in the vertical thermal plate. The first chamber and the second chamber are connected with an inlet and a return port. The second chamber has a flow channel structure connected between the inlet and the return port. The working fluid may flow to the second chamber through the inlet, pass the flow channel structure and return to the first chamber through the return port, so to define a specific flow path leading to a desirable and stable heat transfer efficiency.

Abstract: An immersion liquid cooling heat sink includes a substrate, a fin assembly and a housing. The fin assembly is disposed on the substrate and includes a first fin module and a second fin module, both having multiple passages. Each passage has an inlet and an outlet, the first and second fin modules are spaced from each other to form a first groove which communicate between each inlet of the first fin module and each inlet of the second fin module. The housing is disposed on the substrate and has a first liquid inlet port, and covers the entire fin assembly and exposes each outlet. The first liquid inlet port is arranged corresponding to the first groove and communicates to the first groove, so as to enable a dielectric fluid to flow directly from the mid-section to two ends of the fin assembly.