Patents Assigned to K Systems Corporation
  • Patent number: 8030219
    Abstract: A coated substrate product is described comprising a substrate and a dielectric coating material comprising carbon, hydrogen, silicon, and oxygen. According to the method, the substrate is processed by plasma cleaning the surface and then depositing a dielectric coating by a suitable plasma process. The coating may contain one or more layers. The substrate may be a rigid material or a thin film or foil. The coated products of this invention have superior dielectric material properties and utility as substrates for the manufacture of rolled or parallel plate capacitors with high energy densities.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: October 4, 2011
    Assignees: Morgan Advanced Ceramics, Inc., K Systems Corporation
    Inventors: Fred M. Kimock, Steven J. Finke, Richard L. C. Wu
  • Patent number: 5844770
    Abstract: One aspect of the present invention is directed to a capacitor. The capacitor includes a first layer and a second layer. The first layer includes a first electrically conductive substrate having a first surface and a second surface. A first dielectric film is deposited on the first surface of the first substrate and a second dielectric film is deposited on the second surface of the first substrate. The second layer contacts the first layer. The second layer includes a second electrically conductive substrate having a first surface and a second surface. A third dielectric film is deposited on the first surface of the second substrate, and a fourth dielectric film is deposited on the second surface of the second substrate.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: December 1, 1998
    Assignee: K Systems Corporation
    Inventors: Sandra J. Fries-Carr, Richard L.C. Wu, Peter B. Kosel