Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.

Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.

Abstract: A substrate structure useful for photonics modules comprises a high-thermal-conductivity (e.g., greater than 20 W/m°K) substrate body with a low-thermal-conductivity (e.g., less than 5 W/m°K) dielectric layer overlying at least a portion of the substrate body. Patterned metal layers for electrical circuit connections can be located on the dielectric layer, on the substrate body (under the dielectric layer, on regions of exposed substrate body, or both), or on both. Where the laser is driven at high frequencies (e.g., 2.5 Gbits/sec), the dielectric layer material and thickness can be chosen to provide desired RF behavior. For example, the electrodes and dielectric layer can be configured to provide a transmission line with the desired impedance. Further, where it is desired to solder a component to the substrate, a heater resistor can be formed on the dielectric layer, thereby facilitating soldering the component.

Abstract: An ECLD assembly includes a thermally stabilized substrate, a laser device fixedly mounted in relation to the substrate, and a waveguide with a grating region having a grating formed therein. The waveguide is positioned to receive light emitted by the laser device and is attached to a top surface of the substrate. The ECLD's output wavelength is stabilized by one or more of the following: (1) mounting the waveguide so that its outer surface is less than 60 ?m, and preferably less than about 30 ?m from the top surface of the substrate; (2) placing a thermal cover (e.g.

Abstract: A configurable wavelength multiplexing device having first, second, and third reflectors. The first reflector has a first state in which it transmits incoming light (having first and second wavelengths) along a first transmitted path and a second state in which it reflects the light along a first reflected path. The second reflector reflects the first wavelength and transmits the second wavelength. The third reflector reflects the first wavelength. The first, second, and third reflectors are oriented so that when the incoming light is transmitted along the first transmitted path, the first wavelength is reflected by the second and third reflectors to travel along second and third reflected paths, the third reflected path intersects the first reflector at an angle such that the first wavelength is transmitted by the first reflector and continues on the first reflected path, and the second wavelength is transmitted by the second reflector.

Abstract: A tunable laser system comprises an externalcavity laser diode in combination with an optically coupled waveguide having a Bragg grating formed therein. The laser diode provides a gain medium characterized by a first band of wavelengths. A portion of the fiber and the grating help define an external resonant cavity. The grating limits the wavelengths exiting the external cavity to a second band that is typically much narrower than the first band. The grating region of the waveguide is thermally coupled to a heating element having an associated temperature controller for controllably varying the temperature of the grating region and thus changing the optical pitch of the grating and thus the second band. The grating region of the waveguide can alternatively, or additionally, be subjected to acoustic energy to change the optical pitch of the grating.

Abstract: The non-blocking micro-optic switch matrix (NMSM) includes a plurality of optical routing elements (OREs) forming an M×N matrix. Each ORE of the plurality includes a first and second wafer prism having a gap disposed therebetween. A body of transparent solid material disposed in the gap has a contracted state at a first temperature and an expanded state at a second temperature. The contracted state defines an air gap in the path of light traveling along a first axis, causing light to be deflected along a second axis through total internal reflection. The first and second axes are at a non-zero angle with respect to one another. The expanded state of the transparent material removes the air gap disposed in the path of light traveling along the first axis allowing light to pass through the first wafer prism, through the body of transparent material and into the second wafer prism.

Abstract: An optical routing element (ORE) that can be incorporated into a variety of configurations, to provide the basis for such devices as crossbar switches, wavelength division multiplexers, and add/drop multiplexers. The ORE includes first, second, and third waveguide segments. The first and second waveguide segments extend along a common axis, and are separated by a routing region. The third waveguide segment extends from the routing region at a non-zero angle with respect to the common axis. The routing region is occupied by a selectively reflecting element that selectively reflects light based on a state of the element or a property of the light. The selectively reflecting element may be a thermal expansion element (TEE) or a wavelength-selective filter. A TEE has a body of material having contracted and expanded states at respective first and second temperatures.