Patents Assigned to KABUSH1 KI KAISHA TOSHIBA
  • Patent number: 10985268
    Abstract: A semiconductor device includes a semiconductor substrate including first and second surfaces, and a first semiconductor layer of a first conductivity type, a first electrode on the first surface, a first control electrode that is inwardly from the first surface and electrically insulated from the semiconductor substrate and the first electrode, a second control electrode that is inwardly from the first surface, electrically insulated from the semiconductor substrate and the first electrode via a fourth insulating film, and biased independently from the first control electrode, a third control electrode on the second surface and electrically insulated from the semiconductor substrate, and a second electrode on the second surface and electrically connected to the semiconductor substrate.
    Type: Grant
    Filed: September 2, 2019
    Date of Patent: April 20, 2021
    Assignees: KABUSH1 KI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Tomoko Matsudai, Yoko Iwakaji