Abstract: In production of a closed package-type semiconductor assembly provided with a built-in semiconductor element and conductive leads for connection to outside devices, a conductive island, the conductive leads and other accessories are united together by one stage moulding of molten glass. Simple process reduces the production cost greatly and no use of dusty ceramic components much raises functional reliability of the product.
Abstract: A quartz unit is arranged to permit its automatic manufacture. The quartz unit includes a quartz vibrator; a pair of opposed terminal metal fittings each consisting of a stem part, branch parts protruding from one end of the stem part on two sides thereof to form a Y shape and support parts protruding from the fore ends of the branch parts to carry jointly the quartz vibrator; electrodes of the quartz vibrator connected to the terminal metal fittings through the support parts; and a container consisting of front and rear halves which are joined together to effect sealing with the metal fittings interposed in between them. The stem, branch and support parts are obtained by punching from a metal plate in one unified body.
Type:
Grant
Filed:
January 3, 1984
Date of Patent:
November 5, 1985
Assignees:
Tokyo Denpa Kabushiki Kaisha, Kabushiki Kaisha Goto Seisakusho