Abstract: To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an elastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.

Abstract: A material heating mechanism for melting the material into a molten state, an upper plate to which the upper mold is attached and a lower plate to which the lower mold is attached, at least three position sensors for detecting a distance between the upper mold and the lower mold or the upper plate and the lower plate, and at least three compression hydraulic cylinders installed to any one of the upper plate and the lower plate and individually controlled according to information of the position sensors.

Abstract: A surface of a laminate base body including a projection is caused to penetrate at least a film-shaped laminating body and surely laminated by a simple configuration, and a laminate thereof is formed at a uniform thickness without an occurrence of voids. A laminating device is provided with a heating unit configured to heat at least an insulating resin film; an upper plate and a lower plate configured to be capable of opening and closing, and configured to form a chamber that becomes sealed upon closing; a receiving member having an elasticity and disposed on the upper plate; an elastic membrane body disposed on the lower plate; a vacuuming unit configured to vacuum inside of the chamber; and a compressing unit configured to bloat the elastic membrane body.

Abstract: A vacuum lamination system and a vacuum lamination method are provided in which, when a laminate film and laminate base items are laminated and an excessive portion of the laminate film is cut from the laminated item having the laminate film laminated thereon, a high precision lamination is enabled and the cutting process including a conveying device for cutting the excessive portion of the laminate film can be simplified. In the vacuum lamination system, a laminate film and laminate base items that are conveyed on the carrier film are laminated by the batch type vacuum laminating device, and the laminate film is cut from the laminated item having the laminate film laminated thereon.

Abstract: To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an eleastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.

Abstract: A material heating mechanism for melting the material into a molten state, an upper plate to which the upper mold is attached and a lower plate to which the lower mold is attached, at least three position sensors for detecting a distance between the upper mold and the lower mold or the upper plate and the lower plate, and at least three compression hydraulic cylinders installed to any one of the upper plate and the lower plate and individually controlled according to information of the position sensors.

Abstract: A surface of a laminate base body including a projection is caused to penetrate at least a film-shaped laminating body and surely laminated by a simple configuration, and a laminate thereof is formed at a uniform thickness without an occurrence of voids. A laminating device is provided with a heating unit configured to heat at least an insulating resin film; an upper plate and a lower plate configured to be capable of opening and closing, and configured to form a chamber that becomes sealed upon closing; a receiving member having an elasticity and disposed on the upper plate; an elastic membrane body disposed on the lower plate; a vacuuming unit configured to vacuum inside of the chamber; and a compressing unit configured to bloat the elastic membrane body.

Abstract: A vacuum lamination system and a vacuum lamination method are provided in which, when a laminate film and laminate base items are laminated and an excessive portion of the laminate film is cut from the laminated item having the laminate film laminated thereon, a high precision lamination is enabled and the cutting process including a conveying device for cutting the excessive portion of the laminate film can be simplified. In the vacuum lamination system, a laminate film and laminate base items that are conveyed on the carrier film are laminated by the batch type vacuum laminating device, and the laminate film is cut from the laminated item having the laminate film laminated thereon.

Abstract: A mold clamping system using mold opening and closing mechanisms to move a movable platen toward a fixed platen, engaging half nuts with engagement parts formed at tie bars, and using clamping cylinders to pull tie bars and clamp the mold, provided with position adjustment rods arranged on the opposite sides from the mold attachment surfaces of pistons of the clamping cylinders, a plurality of adjustment cylinders arranged, in parallel with the position adjustment rods, on the fixed platen or movable platen at the side where the clamping cylinders are arranged, and connection members connecting rods of the adjustment cylinders and the position adjustment rods, whereby the mold clamping system is shortened in overall length and simple mechanisms are used to control the position adjustment of the tie bars with a high precision.

Abstract: Powder-particle material in compression molding is transferred using air suction power and filled thinly, evenly and rapidly in a female mold. An adsorption pad 21 which is held so as to be freely movable in the vertical direction is provided at a movable cylinder 7, which can move in the horizontal direction in a space between a metal supply hopper 2 and a female mold 34 and rotate 180°, and powder particle material is laid in a scraped manner at the adsorption pad 21, adsorbed by actuating a vacuum pump 14, transferred to the female mold 34 in this state, turned around and caused to fall into the mold by terminating adsorption.

Abstract: In an injection device 10 having a plunger 11 reciprocably inserted into a heating cylinder 16, in which a molten material M is injected by the plunger 11 via a nozzle 21, a sealing portion 13 set so that the molten material M is prevented from easily entering a gap A between the plunger 11 and an inner wall 32 of the heating cylinder 16 is provided on the portion of the plunger 11, on the side of the nozzle 21, and the portion of the sealing portion 13, on the side of the nozzle 21 is a core keeping portion 14 provided so that an annular portion 20 which is formed on a front portion of the plunger 11 and is connected to a storage portion 19 of the molten material M is formed between the core keeping portion 14 and the inner wall 32 of the heating cylinder 16.

Abstract: A mold clamping system using mold opening and closing mechanisms to move a movable platen toward a fixed platen, engaging half nuts with engagement parts formed at tie bars, and using clamping cylinders to pull tie bars and clamp the mold, provided with position adjustment rods arranged on the opposite sides from the mold attachment surfaces of pistons of the clamping cylinders, a plurality of adjustment cylinders arranged, in parallel with the position adjustment rods, on the fixed platen or movable platen at the side where the clamping cylinders are arranged, and connection members connecting rods of the adjustment cylinders and the position adjustment rods, whereby the mold clamping system is shortened in overall length and simple mechanisms are used to control the position adjustment of the tie bars with a high precision.

Abstract: To form a disk substrate 42 having a no information area at low cost and without failure, a mold 12 is provided for forming a disk substrate 42 having a no information area 44. A cavity 32 of the mold 12 has a surface 50 corresponding to the no information area 44 and made of a mirror-surfaced plate 22. A cylindrical member (sleeve 35) is inserted in an inner hole 38 of the mirror-surfaced plate 22. An annular projection 33 is provided on the end surface of the cylindrical member adjacent to the cavity.

Abstract: A mechanism for pressing a nozzle 26 of an injection device 10 against a die 33, comprises a hooking device 12 which moves so that a hooking body 23 hooks or does not hook on a to-be-hooked portion 24; and a traction device 11 having, on its one end, the hooking device 12 and having, on its other end, the injection device 10. In this mechanism, the portion of the hooking device 12, opposite to the side adjacent to the traction device 11 is attached to the die 33 in the vicinity of the portion of the die 33, against which the nozzle 26 is abutted.

Abstract: In an injection molding machine 1 for supplying clean air 10 to a die 8 in a direction perpendicular to a direction that opens/closes the die 8, in order to effectively pass the clean air 10 through an opened space in the die 8 so as to prevent dust from depositing on a die cavity surface or a molded product when the die 8 is opened and a ventilating hole 12 is provided in a safety door 11 provided so as to be in parallel with the die opening/closing direction.

Abstract: In a die clamping apparatus wherein a movable platen is moved toward a stationary platen, and after a half nut is engaged with an engaging part of a tie bar, the tie bar is pulled by a die clamping cylinder for clamping, provision is made of a first engaging position adjusting mechanism for controlling a movement of the tie bar or the half nut to a half nut engaging position at the time of die thickness adjustment and a second engaging position adjusting mechanism which allows the tie bar or the half nut to move and which moves the tie bar or the half nut to the half nut engaging position at the time of molding.

Abstract: The electric injection molding machine comprises a sensor 21, servo motor 15, a motor 23 and a controller 30 and, in a plasticizing process in which the motor 23 is rotated, the controller 30 performs control by repeating a first process in which the rotation of the servo motor 15 is controlled by a first retreating speed command value 33 to make the screw 13 retreat at a low speed when a screw backpressure signal is smaller than a backpressure set value 31 and a second process in which the rotation of the servo motor 15 is controlled by a second retreating speed command value 34 to make the screw 13 retreat at a high speed when the screw backpressure signal is larger than the backpressure set value 31.

Abstract: An injection molding machine comprises a pre-pressure addition means 2 adding a pre-pressure B acting in the opposite direction of a molding material pressure A received by a screw 1 to a detection means 3 and/or the screw 1, the detection means 3 detecting the axial pressures A and B of the screw, and a screw movement control means 4 controlling the axial pressure based on a different between the pre-pressure B and the molding material pressure A, wherein the pre-pressure addition means 2 is made non-contact with the direction means 3, a forward and backward driving motor 17 is disposed adjacent to a heating cylinder 10, and a screw connector 21 at the rear end of the screw 1 is spline-connected inside a rotating rotor of a screw rotating motor 12. According to the machine, the molding material pressure received by the screw can be accurately detected without being affected by the wear of the machine so as to properly control the axial pressure of the screw and to make the machine compact.

Abstract: The present invention aims at increasing service life of an inner circumferential stamper holder in a die for molding disc substrates that is used when the disc substrates are injection molded. To that end, in the die for molding the disc substrates in which a stamper 3 is supported by at least one of a stationary die 6 and a movable die 1, an abrasion resistant treatment is applied to at least a portion, which abuts against a side surface 3a of a center opening of the stamper 3, of an outer circumferential surface 4a of the inner circumferential stamper holder 4 supporting the stamper 3.

Abstract: A sequence circuit display method for an injection molding machine which enables a sequence circuit corresponding to an operating step to be quickly displayed and enables the connection states of contacts, coils, etc. in a sequence circuit to be easily grasped when obtaining a grasp of the sequence circuit, comprising selectively inputting an operating step name in an injection molding machine from an input device to thereby display a sequence circuit including contacts, coils, etc. corresponding to the selected input operating step as a ladder diagram on a display device; comprising displaying a sequence circuit of an injection molding machine as a ladder diagram on a display device and selectively inputting one of the contacts, coils, etc. in the ladder diagram to thereby display a sequence circuit including contacts, coils, etc. corresponding to the selected input contact, coil, etc. as a ladder diagram on the display device; etc.