Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.

Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.

Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.

Abstract: A first electromagnetic induction pump is disposed in a first reservoir, and a second electromagnetic induction pump is disposed in a second, independent, reservoir. Each reservoir is adapted to contain molten brazing filler metal. The electromagnetic induction pumps are effective to eject the brazing filler metal upward through wave forming portions into contact with an underside of a workpiece being conveyed along a workpiece conveyance path. The second reservoir is disposed downstream of the first reservoir in the direction of conveyance. At least one of the first and second reservoirs include a height adjusting device which permits adjusting the relative heights of the wave forming portions to adapt to the needs of the workpiece. The apparatus may be adapted to contain an intermediate space and an intermediate processing device between the reservoirs.

Abstract: A single reservoir contains brazing filler metal. A first electromagnetic induction pump extends vertically along a vertical plate portion at a workpiece inlet side. A second electromagnetic induction pump extends vertically along a vertical plate portion at the workpiece outlet side. Heaters for melting the brazing filler metal are disposed between the first electromagnetic induction pump and the second electromagnetic induction pump. Each electromagnetic induction pump has a first iron core having an induction coil wound therearound disposed at the outer side of a vertical plate portion at the workpiece inlet side or the workpiece outlet side respectively. A second iron core is disposed at the inner side of the respective vertical plate portion. A brazing filler metal rising gap is disposed between the second iron cores.

Abstract: An automatic soldering apparatus wherein a fixture is conveyed sequentially and endlessly by an elevation mechanism of a loading unit, soldering conveyors of a plurality of units that relate to the soldering operation, an elevation mechanism of an unloading unit, and return conveyors of units relating to the soldering operation; works are automatically fitted to the fixture by the loading unit, and while the fixture is being conveyed by the soldering conveyor of each of the units which relate to the soldering operation and are combined with one another suitably, whenever necessary, the soldering operation of the works and other operations associated therewith are carried out; and the unloading unit automatically recovers the works from the fixture and the empty fixture is returned to the loading unit by the return conveyors of the units relating to the soldering operation so that the works are again fitted to the fixture by the loading unit.

Abstract: An automatic soldering apparatus wherein a fixture is conveyed sequentially and endlessly by an elevation mechanism of a loading unit, soldering conveyors of a plurality of units that relate to the soldering operation, an elevation mechanism of an unloading unit, and return conveyors of units relating to the soldering operation; works are automatically fitted to the fixture by the loading unit, and while the fixture is being conveyed by the soldering conveyor of each of the units which relate to the soldering operation and are combined with one another suitably, whenever necessary, the soldering operation of the works and other operations associated therewith are carried out; and the unloading unit automatically recovers the works from the fixture and the empty fixture is returned to the loading unit by the return conveyors of the units relating to the soldering operation so that the works are again fitted to the fixture by the loading unit.

Abstract: A method of and apparatus for controlling automatic soldering system in which respective units of the automatic soldering system are controlled preparatorily to reduce the waiting time until main driving to zero. In the soldering driving time, the temperature of the work itself is precisely controlled to the predetermined value by means of directly measuring the temperature of the work and controlling the preheater to bring the soldering characteristic in the next soldering step into the most optimal value in compliance with the size and the like of the work to be soldered.

Abstract: A jig for arraying and supporting a multiplicity of articles to be soldered wherein pairs of lower supporting wires are extended for supporting the lower side of respective articles between frame members adapted to be secured to a conveyor holder of a soldering line, pairs of upper supporting wires are arranged above the lower supporting wires in parallel with the latter along both side surfaces of respective articles, one end of each of the upper supporting wires being passed loosely through a hole formed on the frame member, and a gate member supporting the other ends of said upper supporting wires is provided movably up and down with respect to the frame member.

Abstract: An automatic soldering apparatus which makes it possible to automate the whole steps, from the step of feeding the work to the step of collecting the same, as well as simultaneously enhance the reliability in transportation and the economy in soldering operation. The automatic soldering apparatus has a track type transportation mechanism for slidably transporting the body of the work having lead portions to be soldered, through a track constituted by a plurality of long guide members; a fluxing unit and a soldering unit provided with respect to the track of the track type transportation mechanism and adapted to flux and solder the lead portions, respectively; a work feed unit provided at the starting end of the track type transportation mechanism and adapted to feed the work to the track type transportation mechanism; and a work collecting unit provided at the terminating end of the track type transportation mechanism and adapted to collect the work from the track type transportation mechanism.

Abstract: A jig apparatus for arraying and supporting work to be soldered wherein a plurality of lower supporting bars for supporting the lower side of a work are arranged so as to extend in a frame designed to be mounted on a conveyor holder of an automatic soldering line, upper supporting bars are arranged so as to extend above and in parallel with the lower supporting bars to press the work from the upper side thereof. The upper supporting bars have one end fitted to the frame. A gate member supports the other end of the upper supporting bars and movable up and down with respect to the frame. Work insertion openings are formed in the frame such as to oppose the gate member. The lower supporting bars are made of elongated channel members with a substantially U-shaped cross-section, each of the elongated channel members having holes formed in the floor thereof.