Patents Assigned to KABUSHIKI KAISHA TOSHIBA and
  • Patent number: 10789144
    Abstract: According to one embodiment, a supervisory circuit includes a trigger determination circuit and a trigger table. The trigger determination circuit receives signal processing signals outputted from a plurality of signal processing circuits as trigger signals, determines whether processing operations by the signal processing circuits are executed in a predetermined order, and outputs an interrupt signal when detecting a trigger signal out of setting. The trigger table is provided with trigger-specific tables corresponding to the respective signal processing circuits, reads a trigger setting to occur next based on a trigger determined as being correct by the trigger determination circuit, and outputs a table read signal to the trigger determination circuit.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 29, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Akihiro Kobayashi, Makoto Kanda, Shigeru Itoh, Hiroshi Nishikawa, Wataru Furuichi, Kiyoshige Taga, Itsuro Nomura
  • Patent number: 10790860
    Abstract: A method of decoding data stored in non-volatile memory in which each memory cell stores data by adopting one of a plurality of storage states.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 29, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Memory Corporation
    Inventors: Amr Ismail, Magnus Stig Torsten Sandell
  • Patent number: 10788545
    Abstract: According to one embodiment, a sensor includes a supporter, a first film portion, a first sensing element, and a first magnetic portion. The first film portion is supported by the supporter, is deformable, and includes a first fixed end extending along a first fixed end direction. A first sensing element is fixed to the first film portion, and includes a first magnetic layer, a first opposing magnetic layer provided between the first magnetic layer and the first film portion, and a first intermediate layer provided between the first magnetic layer and the first opposing magnetic layer. A direction from the first opposing magnetic layer toward the first magnetic layer is aligned with a first element direction. The first magnetic portion includes a first end portion extending along a first end portion direction tilted with respect to the first fixed end direction, and overlaps a portion of the supporter.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: September 29, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shotaro Baba, Yoshihiko Fuji, Akiko Yuzawa, Kei Masunishi, Michiko Hara, Shiori Kaji, Tomohiko Nagata, Yoshihiro Higashi, Kazuaki Okamoto
  • Patent number: 10789976
    Abstract: According to one embodiment, a magnetic head includes a magnetic pole, a first shield, a second shield, a first stacked body and a second stacked body. At least a portion of the magnetic pole is provided between the first and second shields. The first stacked body is provided between the magnetic pole and the first shield. The second stacked body is provided between the magnetic pole and the second shield. The first stacked body includes a first magnetic layer including, a first conductive layer provided between the magnetic pole and the first magnetic layer, and a second conductive layer provided between the first magnetic layer and the first shield. The second stacked body includes a second magnetic layer including, a third conductive layer provided between the magnetic pole and the second magnetic layer, and a fourth conductive layer provided between the second magnetic layer and the second shield.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: September 29, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Naoyuki Narita, Tomoyuki Maeda
  • Patent number: 10786204
    Abstract: According to one embodiment, an electronic device includes an attaching member and a sensing circuit. The attaching member includes a face configured to be attached to a detection target. The sensing circuit includes a sensing interface provided on the face. The sensing circuit is configured to obtain information related to a contact state between the sensing interface and the detection target from the sensing interface.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: September 29, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Nobuhiro Yamamoto, Takahisa Funayama
  • Patent number: 10790553
    Abstract: According to one embodiment, a wiring diagnostic apparatus of embodiments includes a counter, an acquirer, and an abnormality determiner. The counter counts the number of battery modules connected to a plurality of first communication lines to which a plurality of battery modules are connected to form a communication channel for each of the first communication lines. The acquirer acquires identification information for identifying a battery module connected to a corresponding second communication line among battery modules connected to a plurality of second communication lines each forming a communication channel with a first communication line via the second communication line. The abnormality determiner determines an abnormality in a wiring relationship of the first communication line or the second communication line on the basis of the number of battery modules counted by the counter and identification information acquired by the acquirer.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: September 29, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
    Inventors: Ryo Okabe, Shinichiro Kosugi, Masahiro Sekino, Norihiro Kaneko, Yusuke Kikuchi, Kazuto Kuroda, Makoto Noguchi
  • Patent number: 10790219
    Abstract: According to one embodiment, a semiconductor package includes a die pad, a semiconductor chip, a lead frame, and an insulating part. The semiconductor chip is provided on the die pad. The lead frame is separated from the die pad. The lead frame is electrically connected to a terminal of the semiconductor chip. The lead frame includes a first part and a second part disposed between the first part and the die pad. An upper surface of the first part is located below an upper surface of the second part. The insulating part is provided on the die pad, the semiconductor chip, and the second part. The insulating part seals the semiconductor chip.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: September 29, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihisa Imori, Kenji Yamada
  • Patent number: 10790781
    Abstract: According to one embodiment, there is provided a semiconductor integrated circuit including an oscillation circuit, a charge pump circuit, a smoothing circuit, and a negative feedback circuit. The charge pump circuit is arranged between each of a power supply input terminal and the oscillation circuit and a power supply output terminal. The smoothing circuit is arranged between the charge pump circuit and the power supply output terminal. The negative feedback circuit is arranged on a path returning from the smoothing circuit to the oscillation circuit. The smoothing circuit includes a first zero point generation circuit.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: September 29, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Hironori Nagasawa
  • Patent number: 10789454
    Abstract: An image processing device includes one or more processors. The processors detects two or more first partial areas corresponding to each of two or more portions among a plurality of portions that are included in an object and that are set in advance from a first image, and detect two or more second partial areas corresponding to each of two or more portions among the portions from a second image. The processors extracts two or more first feature vectors from two or more of the first partial areas, and extract two or more second feature vectors from two or more of the second partial areas. The processors determines whether an object included in the first image and an object included in the second image are same, by using the first feature vectors and the second feature vectors.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 29, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomoyuki Shibata, Yuto Yamaji, Daisuke Kobayashi
  • Patent number: 10789515
    Abstract: According to an embodiment, an image analysis device includes one or more processors. The one or more processors configured to: calculate a feature map of a target image; calculate context score information representing context of each pixel in the target image on the basis of the feature map; calculate shape score information representing a shape of an object in at least one region included in the target image on the basis of the feature map; correct the shape score information in the at least one region using the context score information in a corresponding region; and output the corrected shape score information in the at least one region.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 29, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Quoc Viet Pham
  • Patent number: 10790214
    Abstract: To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: September 29, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Takayuki Naba, Hiromasa Kato, Masashi Umehara
  • Patent number: 10786781
    Abstract: A carbon dioxide separation and capture apparatus includes an absorption tower configured to cause an absorbing liquid to absorb a carbon dioxide gas contained in a process gas and a regeneration tower configured to cause the absorbing liquid from the absorption tower to release the carbon dioxide gas. The carbon dioxide separation and capture apparatus further includes an inlet concentration meter configured to measure concentration of an acid component in the process gas supplied to the absorption tower and an outlet concentration meter configured to measure concentration of the acid component in the process gas discharged from the absorption tower.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: September 29, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keita Nagano, Mitsuru Udatsu, Masatoshi Hodotsuka
  • Patent number: 10790543
    Abstract: According to one embodiment, a secondary battery is provided. The separator includes a porous self-supporting film, a solid electrolyte layer, and a first binder. The solid electrolyte layer is provided on one main surface of the porous self-supporting film. The porous self-supported film and the solid electrolyte layer are adhered with the first binder. The first binder exists on both of the one main surface and another main surface of the porous self-supporting film. The solid electrolyte layer includes solid electrolyte particles and a second binder. The solid electrolyte particles have alkali metal ions conductivity. The polymeric material of the second bonder is a same as the polymeric material of the first material.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 29, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yasuyuki Hotta, Shinsuke Matsuno, Norio Takami
  • Patent number: 10789488
    Abstract: According to an embodiment, an information processing device includes one or more processors. The one or more processors is configured to acquire a map in which, for each of grids in a particular space, observation information representing object information on an object or the observation information representing non-observation information on non-observation of the object is correlated; and correct, for each of the grids, correlation of the observation information by using a learned model based on the observation information correlated with other peripheral grids.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 29, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Sugiura, Tomoki Watanabe
  • Patent number: 10789705
    Abstract: A quality monitoring system according to an embodiment includes an imager, an inspector, and a processor. The imager repeatedly acquires a first image of an equipment. The equipment repeats a first operation processing a workpiece. The first image is of the equipment imaged at a first timing of the first operation. The inspector inspects a quality of the workpiece after processing. The processor decides, based on a plurality of the first images, an evaluation of the equipment imaged in each of the first images. The processor analyzes a correlation between a plurality of the evaluations and a plurality of the qualities.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 29, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Risa Sakai, Wataru Yamada
  • Patent number: 10787393
    Abstract: The present invention provides a silicon nitride sintered body including silicon nitride crystal grains and a grain boundary phase, wherein the silicon nitride crystal grains are covered with the grain boundary phase and width of the grain boundary phase is 0.2 nm or more. It is preferable that the width of the grain boundary phase is 0.2 nm to 5 nm. Additionally, it is preferable that the silicon nitride sintered body includes 15% by mass or less of the grain boundary phase. According to the above-described configuration, it is possible to provide a high-temperature-resistant silicon nitride sintered body in which degradation of the grain boundary phase under high temperature environment is suppressed. This silicon nitride sintered body is suitable for constituent material of a high-temperature-resistant member, use environment of which is 300° C. or higher.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: September 29, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Isao Ikeda, Kai Funaki, Yutaka Abe
  • Publication number: 20200303783
    Abstract: A secondary battery includes a positive electrode, a negative electrode and an electrolyte containing aqueous electrolyte. The negative electrode is provided with a negative electrode current collector having a compound including aluminum, and a negative electrode active material including titanium on a granule surface of the negative electrode current collector. A ratio of an atomic concentration of aluminum atoms to sum of atomic concentrations of aluminum atoms and titanium atoms on a surface of the negative electrode ({Al atomic concentration/(Al atomic concentration+Ti atomic concentration)}×100) is 3 atm % or more and 30 atm % or less.
    Type: Application
    Filed: December 18, 2019
    Publication date: September 24, 2020
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yumiko SEKIGUCHI, Shinsuke MATSUNO, Norio TAKAMI
  • Publication number: 20200300988
    Abstract: An electronic apparatus capable of determining a distance to an object based on reflected light provided by a reflection of a pulsed light on the object, includes input terminal configured to receive a signal of intensity of reception light. Processing circuitry determines a measurement range capable of specifying a peak of the reception light based on the intensity of the reception light, detects the reflected light by specifying the peak of the reception light within the measurement range, determines, based on the measurement range, a duration from when the pulsed light is emitted until when the reflected light is received, and determines a distance from the electronic apparatus to the object according to the duration.
    Type: Application
    Filed: September 9, 2019
    Publication date: September 24, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hidenori OKUNI, Tuan Thanh TA, Satoshi KONDO, Akihide SAI
  • Publication number: 20200302767
    Abstract: According to one embodiment, a fire detection system includes a combustion gas detection sensor, first chemical sensor configured to detect a first gas, and alarm configured to operate based on detection signals of the combustion gas detection sensor and the first chemical sensor and notify fire.
    Type: Application
    Filed: September 13, 2019
    Publication date: September 24, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Yoshiaki SUGIZAKI
  • Publication number: 20200300975
    Abstract: An electronic apparatus capable of determining a distance to an object based on reflected light provided by a reflection of pulsed light on the object has detectors configured to detect reception light to measure times from an emission of the pulsed light to detections of the reception light; and processing circuitry configured to determine a duration in which the reflected light is received based on the times, determine, based on one of the times in the duration, a reception timing of the reflected light included in the reception light, and determine the distance from the electronic apparatus to the object according to the reception timing of the reflected light.
    Type: Application
    Filed: September 9, 2019
    Publication date: September 24, 2020
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hidenori OKUNI, Tuan Thanh TA, Satoshi KONDO, Akihide SAI