Abstract: A collision behavior control apparatus which comprises a contacting portion disposed in a portion of the front of a vehicle, and which, at the time of collision against a pedestrian or a two-wheeler with a rider riding thereon, controls the behavior of the pedestrian or the two-wheeler rider by pushing the pedestrian or the two-wheeler rider separated from the two-wheeler with the contacting portion, wherein the pedestrian or the two-wheeler rider is pushed by the contacting portion such that the pedestrian or the two-wheeler rider is not bumped up onto the hood, whereby the pedestrian or the two-wheeler rider is moved to the vehicle side.

Abstract: A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.