Abstract: A semiconductor device package incorporating a connector that reduces manufacturing operations and enables efficient manufacturing. The semiconductor device package includes a primary molded product and a secondary molded product. The primary molded product includes a semiconductor device, a lead connected to the semiconductor device, and a plug terminal formed by at least part of the lead. The primary molded product envelops the semiconductor device and part of the lead in a first resin material. The secondary molded product envelops the primary molded product in a second resin material and includes a connector guide surrounding the plug terminal and used to guide insertion of a holder holding a socket terminal connectable to the plug terminal.

Abstract: In the lever apparatus, a cover part (19) including a spherical-shaped outer surface and two thickness-reducing recessed portions (18) formed on the inner surface side thereof is disposed on the base end portion of a lever upper (12) and fitting recessed portions (21), instead of the rotatably-supporting shaft portions which are used in the conventional lever apparatus, are formed in the mounting part (20) of the lever upper. When molding the lever upper, molds for molding the thickness-reducing recessed portions can be slided in the projecting direction of the mounting part, thereby being able to facilitate the manufacture of the lever upper and thus lever (11).