Abstract: A vertical cavity surface-emitting laser package comprising: a first lead frame and a second lead frame, wherein the signal is inputted from the first lead frame and connected to ground through the second lead frame, and the two lead frames are approximately parallel to each other; a vertical cavity surface-emitting laser diode, disposed above the front portion of the first lead frame and connected to the front portion of the second lead frame via a bonding wire; and epoxy resin packing the space around the front portions of the first and second lead frames, the vertical cavity surface-emitting laser diode, and the bonding wire for fixing and protecting them from damages.